XICOR parts naming conventions

XICOR parts naming conventions

X XXXXX X X X (-XX)

1 2 3 4 5 6

EEPOT X XXXX X X X

1 2 7 3 4

Serial flash X XX X XXX X X -X

1 2 3 4 8

1. Prefix

2. Device model

3. Packaging form:

D ceramic double inline P plastic double inline

E leadless chip carrier R ceramic micro package

J plastic leaded chip carrier T thin micro package

K-pin Vibrating Column V Thin Shrink Miniature Package L Thin Quad Flat Lead X Module

M male micro package Y new card type

4. Temperature range: blank standard, BB grade (MIL-STD-883), E-20 ℃ to 85 ℃, 1-40C to 85 ℃, M-55 ℃ to 125 ℃

5. Process level: blank standard, BB level (MIL-STD-883)

6. Access time (only for EEPROM and NOVRAM):

20200NS, 25250NS, blank 300ns, 35350ns, 45450ns

5555ns, 7070ns, 9090ns, 15 150ns Vcc limits (serial EEPROM only):

Blank 4.5V to 5.5V, -33V to 5.5V

-2.72.7V to 5.5V, -1.81.8V to 5.5V

7. End-to-end resistance:

Z1KQ, Y2KΩ, W10KQ, U50KΩ, T100KΩ

8.Vcc limit: blank 1.8V to 3.6V, -54.5V to 5.5V

Intersil Corporation is a global designer and manufacturer of high performance analog semiconductors technology which located in Milpitas, California. Intersil was built on a solid foundation. Nowadays while increasing profitability and cash flow, Intersil continued focus on leading in attractive high performance analo.

Tag: XICOR

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