Vicor Corporation’s VI Chip Bus Converter Module Family in a ChiP Package Named the Winner of the Prestigious UBM Canon ACE Award in the Power Category

Vicor Corporation (NASDAQ: VICR) today announced that its VI Chip® Bus Converter Module (BCM®) family in a ChiP package has been named the winner in the EE Times and EDN 2015 UBM Canon ACE Awards in the Ultimate Products ‘Power’ category. The ACE Awards program honors the people and companies behind the technologies and products that are changing the world of electronics.

The ACE (Annual Creativity in Electronics) Awards, established in 2005 and presented by EE Times and EDN, are awarded each year to acknowledge innovation and leadership in the electronics industry. A panel of EE Times and EDN editors narrowed down the entries to three finalists in each category. Winners were determined from among the finalists by a panel of independent judges, and were announced at an awards ceremony on July 21 at the Santa Clara Convention Center, during the Embedded Systems Conference Silicon Valley.

Based on Vicor’s advanced Converter housed in Package™ (ChiP) power component platform, VI Chip BCMs provide power density up to 2,750 W/in3 – 5X the power density of competing solutions – and supply up to 1.75 kW with 98% peak efficiency. VI Chip BCMs in a ChiP package provide an isolated intermediate bus voltage to power non-isolated point-of-load (PoL) converters or serve as an isolated voltage source for high performance systems spanning ATE, datacenter, telecom, and industrial applications.

“We are continually amazed at the level of creativity in the design, innovation and technology showcased by these award winners,” said Suzanne Deffree, Executive Editor at UBM Canon's EDN. “The ACE Awards celebrate the highest achievements in innovation and creativity in electronic design, and selecting one organization, individual or technology that stands out above the rest is incredibly challenging. We are pleased to be able to celebrate their achievements.”

“Vicor’s VI Chip BCM product family in a ChiP package exemplifies the benefits of the Power Component Design Methodology, equipping designers to architect high performance power systems – from the power source to the point of load – using modular, building block components,” said Rob Russell, Vice President Product Marketing, Vicor Power Systems. “This honor from UBM Canon is a testament to our significant investment in power electronics innovation and our continued commitment to helping our customers achieve the highest levels of power performance and design flexibility.”

About UBM Canon
UBM Canon is the leading B-to-B event producer, publisher, and digital media company for the world's $3 trillion advanced, technology-based manufacturing industry. Our print and electronic products deliver trusted information to the advanced manufacturing market and leverage our proprietary 1.3 million name database to connect suppliers with buyers and purchase influencers. We produce more than 50 events and conferences in a dozen countries, connecting manufacturing professionals from around the globe. UBM Canon is part of UBM plc (UBM.L) a global provider of media and information services for professional B-to-B communities and markets.

About the Embedded Systems Conference
The Embedded Systems Conference (ESC) is where the global design engineering community gathers to learn, collaborate and celebrate innovation. Held in Silicon Valley, Boston, and Minneapolis, ESC empowers the global design engineering community with hundreds of essential technical training classes and accreditation opportunities. For more information and to register for ESC

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