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Home > Embedded technology > Toshiba Memory Corporation introduced new Embedded Flash Memory Produc

Toshiba Memory Corporation introduced new Embedded Flash Memory Products for Automotive Applications.

Published time: 2019-12-20 15:58:06

Toshiba Memory Corporation, the world leader in memory solutions, announced that it has begun sampling new Automotive JEDEC UFS Version 2.1 embedded memory solutions utilizing 3D flash memory. 

The sequential read and write performance are improved by approximately 6 percent and 33 percent, respectively, over existing devices.

The new devices support a temperature of range -40°C to +105°C,meets AEC-Q100 Grade2 requirements and offers the enhanced reliability required by various automotive applications.

The four-member lineup includes devices of 32GB, 64GB, 128GB, and 256GB capacity.

The new UFS devices feature several functions well-suited to the requirements of automotive applications, including Refresh, Thermal Control and Extended Diagnosis. The Refresh function can be used to refresh data stored in UFS, and helps to extend the datas lifespan. The Thermal Control function protects the device from overheating in the high-temperature circumstances that can occur in automotive applications. Lastly, the Extended Diagnosis function helps users easily understand the devices status.

Technology advances in automotive information & entertainment systems and ADAS related products for the realization of connected cars and autonomous vehicles will continue to push the storage demands in automotive applications ever higher. 

The new Toshiba devices are embedded flash memory units that integrate FLASH 3D flash memory and a controller in a single package. The high memory capacity of these devices is due to their bit cost scalable (BiCS) architecture that involves building many layers of memory structure on top of each other.


 Toshiba’s previous generation of 64 Layer stacked memory
 

BiCS structure can be envisioned by comparing a single-storied dwelling to a multi-floored apartment complex. The result is a memory chip of enormous capacity that takes up comparatively little board real-estate.

As these demands continue to grow, Toshiba Memory Corporation will retain a leadership position in the market by reinforcing its lineup of high-performance, high-capacity memory solutions targeting the sector.


UFS Memory Rises to the Challenge of the Automotive Environment

Toshiba Memory's Universal Flash Storage (UFS) is widely used today in a variety of devices, including the ubiquitous smartphone. As Scott Beekman, Director of Managed Flash Memory Products, sees things, “It’s only natural that automotive applications follow the same course.” 

And they’ll certainly be facing some tough challenges. While the passenger compartment of a modern vehicle is almost as comfortable as a living room, the rest of the vehicle presents enormous challenges to any electronic device. 

There are extremes of temperature, humidity, ice and snow, as well as circuit-crunching shock and vibration. And with connected cars and autonomous vehicles expected to generate enormous quantities of data, the storage requirements for automotive applications will continue to increase.

To help them live up to the challenges they’ll face, these new UFS devices feature several functions including new Refresh, Thermal Control, and Extended Diagnosis functions.

The Refresh function can be used to refresh data stored in UFS and helps extend the data’s lifespan.

The Thermal Control function protects the device from overheating in the high-temperature circumstances that can occur in automotive applications.

The Extended Diagnosis function helps users easily understand the device’s status.

In addition, all members of the new line adhere to the Joint Electron Device Engineering Council’s (JEDEC) Universal Flash Storage (UFS) standard specification.

Lineup of the New Products

THGAFBG8T13BAB7  32GB 153Ball FBGA
THGAFBG9T23BAB8 64GB 153Ball FBGA
THGAFBT0T43BAB8 128GB 153Ball FBGA
THGAFBT1T83BAB5 256GB 153Ball FBGA
 

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