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Home > Other > ST parts naming conventions

ST parts naming conventions

Published time: 2020-04-21 14:26:54

ST parts naming conventions

Ordinary linear, logic devices

MXXX   XXXXX    XX   X  X

 1          2       3      4  5

1. Product series:

74AC / ACT ..... Advanced CMOS HCF4XXX

M74HC ........ High speed CMOS

2. Serial number

3. Speed

4. Packaging:

BIR, BEY .... Ceramic double in-line

M, MIR ....... Plastic micro-package

ST parts

5. Temperature

Ordinary storage device

XX    X     XXXX   X   XX   X   XX

1       2        3   4     5 6     7

1. Series:

ET21 static RAM

ETL21 static RAM

ETC27 EPROM

MK41 fast static RAM

MK45 bipolar port FIFO

MK48 static RAM

TS27 EPROM

S28 EEPROM

TS29 EEPROM

2. Technology:

Blank ... NMOS

C ... CMOS

L ... low power

3. Serial number

4. Packaging:

C ceramic double row

J ceramic double row

N plastic double row

Q UV window ceramic fusion seal double in-line

5. Speed

6. Temperature:

Blank 0C ~ 70C

E -25C 70C

V -40C ~ 85C

M -55C ~ 125C

7. Quality level:

blank

B / B MIL-STD-883B

standard

Class B

Memory number (U.V EPROM and one-time programmable OTP)

M XX   X    XXX    X   X    XXX   X  X

        1  2     3      4     5     6        7 8

1. Series:

27 ... EPROM

87 ... BPROM latch

2. Type:

Blank ... NMOS,

C ... CMOS,

V ... low power

2. Capacity:

64 ... 64K bits (X8)

25 ... 256K bits (X8)

512 ... 512K bits (X8)

1001 ... 1M bits (X8)

101 ... 1M bits (X8) low voltage

1024 ... 1M bits (X8)

2001 ... 2M bits (X8)

201 ... 2M bits (X8) low voltage.

4001 ... 4M bits (X8)

401 ... 4M bits (X8) low voltage

4002 ... 4M bits (X16)

801 ... 4M bits (X8)

161 ... 16M bits (X8 / 16) optional

160 ... 16M bits (X8 / 16)

4. Improvement level

5. Voltage range:

blank

5V + 10% Vcc,

X 5V + 10% Vcc

6. Speed:

5555n,

60 60ns,

70 70ns,

8080ns

9090ns,

100/10 100 n

120/12 120 ns,

150/15 150 ns

200/20200 ns,

250/25 250 ns

7. Packaging:

F ceramic double in-line (window)

L leadless chip carrier (window)

B plastic double in-line

C plastic leaded chip carrier (standard)

M plastic micro package

N thin miniature package

K plastic leaded chip carrier (low voltage)

8. Temperature:

1 0C ~ 70C,

6 -40C ^ 85C,

3 -40C 125C

Flash EPROM number

M   XX  X  A   B   C   X   X    XXX    X   X

       1       2   3   4   5   6    7     8     9 10

1. Power supply

2. Type:

F5V + 10%,

V 3.3V + 0.3V

3. Capacity:

11M,

2 2M,

33M,

8 8M,

16 16M

4. Erase:

0 Large capacity

1 Top start logic block

2 Bottom boot logic block 4 sectors

5. Structure:

0 X8 / X16 can be selected,

1X8 only,

2X16 only

6. Modification:

Blank A

7. Vcc:

Blank 5V + 10% Vcc

X + 5% Vcc

8. Speed:

60 60ns,

70 70ns,

80 80ns,

90 90ns

100 100ns,

120 120ns,

150 150ns,

200 200ns

9. Packaging:

M plastic micro package

N thin miniature package, dual in-line

C / K plastic leaded chip carrier

B / P plastic double in-line

10. Temperature:

1 0C ~ 70C,

6 -40C 85C,

3 -40C ~ 125C

Flash RPROM number of only 3V and only 5V

M   XX    X    XXX    X    XXX  X  X

        1     2     3     4     5     6    7

1. Device series:

29 flashes

2. Type:

F 5V single power supply

V 3.3 single power supply

3. Capacity:

100T (128KX8. 64KX16) top block,

100B (128KX8.64KX16) bottom block

200T (256KX8. 64KX16) top block,

200B (256KX8. 64KX16) bottom block

400T (512KX8. 64KX16) top block,

400B (512KX8. 64KX16) bottom block

040 (12KX8) sector,

080 (1MX8) sector

016 (2MX8) sector

4. Vcc:

Blank 5V + 10% Vcc,

X + 5% Vcc

5. Speed:

60 60ns,

70 70ns,

80 80ns

90 90ns,

120 120ns

6. Packaging:

M plastic micro package

N thin miniature package

K plastic leaded chip carrier

P plastic double in-line.

7. Temperature:

1 0C ~ 70C,

6 -40C * 85C,

3 -40C * 125C

Serial EBPROM number

ST     XX   XX   XX    X   X   X

          1        2        3    4    5  6

1. Device series:

2412C,

2512C (low voltage),

93 micro wire

95 SPI bus

28 EEPROM

2. Type / craft:

C CMOS (EEPROM)

B extended IC bus

W Write Protector

CS write protection (microwire)

P SPI bus

LV low voltage (EEPROM)

3. Capacity:

01 1K,

02 2K,

04 4K,

08 8K

16 16K,

32 32K,

64 64K

4. Modification: blank A, B, C, D

5. Packaging:

B 8-leg plastic double in-line

M 8-leg plastic miniature package

ML 14 leg plastic micro package

6. Temperature:

1 0C ~ 70C

6 -40C 85C

3 -40C 125C.

1. Prefix

2. Series:

62 ordinary ST6 series

63 dedicated video ST6 series

72 ST7 series

90 ordinary ST9 series

92 dedicated ST9 series

10 ST 10-bit series

20 ST20 32-bit series

3. Version:

Blank ROM

T 0TP (PROM)

R ROM1ess

P There are lead holes on the cover

E EPROM F flash

4. Serial number.

5. Packaging:

B plastic double in-line

D ceramic double row true plug

F fusion seal inline

M plastic micro package

S ceramic miniature package

CJ plastic leaded chip carrier

K leadless chip carrier

L ceramic leaded chip carrier

QX plastic four-sided lead flat package

G ceramic four-sided flat package into a pin array

R ceramic array

T thin four-sided lead flat package

6. Temperature range:

1.5 0C 70C (civilian)

2 -40C 125C (Automotive industry)

61 -40C ~ 85C (industrial)

E -55C 125C

Tag: ST
 

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