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Home > Other > NXP Launches Comprehensive RF Power Multi-Chip Module Portfolio

NXP Launches Comprehensive RF Power Multi-Chip Module Portfolio

Update Time: 2019-12-20 11:18:16


NXP Semiconductors has announced that its comprehensive RF Power Multi-Chip Module (MCM) portfolio will be available worldwide to support the development of large-scale MIMO active antenna systems for 5G base stations. NXP's 5G Airfast solution is more integrated, reducing power amplifier size, shortening design cycles and simplifying manufacturing processes.

Paul Hart, senior vice president and general manager of NXP's radio power solutions, said: "The deployment of 5G infrastructure networks is faster than the previous generation. Our 5G massive MIMO solution provides a common package of frequencies and power to help customers and Mobile network operators are reducing time to market."

Simplify 5G base station deployment

The NXP RF Power Multi-Chip Module is a 50 Ω input/output, integrated Doherty two-stage device that helps eliminate RF complexity, avoids multiple prototyping, and improves design predictability. Its pin compatibility supports design reuse. Reducing the number of components avoids redundant testing while increasing throughput and shortening the certification cycle.

NXP's integrated solution's printed circuit board size is five times smaller than traditional RF designs, helping to address the high-end mMIMO size and weight challenges. For example, the 64T64R requires 64 power amplifiers per antenna.

Multi-Chip Module

Comprehensive product portfolio

The Airfast integrated portfolio includes LDMOS power amplifier modules, GaAs/SiGe pre-driver modules and receiver modules for the 2.3 GHz to 3.8 GHz cellular band with output powers from 3 W to 5 W:

Power amplifier module:

● AFSC5G37D37 (3.7 Ghz band, average 37 dBm)

● AFSC5G35D37 (3.5 Ghz band, average 37 dBm)

● AFSC5G35D35 (3.5 Ghz band, average 35 dBm)

● AFSC5G26D37 (2.6 Ghz band, average 37 dBm)

● AFSC5G23D37 (2.3 Ghz band, average 37 dBm)

Front drive module:

● AFLP5G35645 (3.5 Ghz and 3.7 Ghz bands, average 29 dBm)

● AFLP5G25641 (2.3 Ghz and 2.6 Ghz bands, average 29 dBm)

Receiver module:

● AFRX5G372 (LNA+ switch in the 3.5 GHz to 5 GHz band)

● AFRX5G272 (LNA+ switch in 2.3 Ghz and 2.6 Ghz bands)

Power amplifier modules are now available for order from NXP dealers and retailers. NXP's new RF circuit library (a digital library containing more than 400 RF power reference circuits) supports these modules.

NXP's 5G end-to-end communications infrastructure portfolio

With innovative LTE, processing and RF solution expertise, NXP offers a robust portfolio of 5G technology. These products include the industry's broadest portfolio of products from DC to millimeter wave frequencies, from 1.8 mW to 1.8 kW. Leading technologies in GaN, LDMOS, SiGe and GaAs. In addition, NXP has unique internal technologies for 5G applications, and the Layerscape 5G Access Edge platform delivers first-class security and performance. We also offer open 5G infrastructure solutions that can scale to a wide range of system types and are suitable for different implementations or future specification changes.

The NXP and NXP logos are trademarks of NXP B.V. All other product or service names are the property of their respective owners.

Tag: Chip

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