Panasonic Power CSP MOSFETs
Panasonic has put forward the brand slogan “A Better Life, A Better World” to embody its founding management philosophy “to contribute to the progress and development of society through its business activities.” Guided by this slogan, the Company is endeavoring to offer “A Better Life, A Better World” to each and every customer around the world across its four core business areas: Consumer Electronics, Housing, Automotive, and B2B
The history about Panasonic
March, 1918 Konosuke Matsushita founded Matsushita Denkikigu Seisakusho at Daikai-cho, Fukushima-ku, Osaka and started to manufacture wiring instrument.
January, 1952 Formed a capital alliance with Nakagawa Kikai Kabushiki Kaisha (subsequently renamed Matsushita Refrigeration Company).
December, 1952 Established Matsushita Electronics Corporation through a technology alliance with Philips in Netherlands, and transferred four lamp manufacturing factories to this establishment.
January, 1958 Established Matsushita Communication Industrial Co., Ltd. (subsequently renamed Panasonic Mobile Communications Co., Ltd.), and transferred communication equipment manufacturing section to this establishment.
September, 1959 Established Matsushita Electric Corporation of America (currently Panasonic Corporation of North America). (Since then, established manufacturing and sales sites at various locations in the world.)
October, 2002 Made Matsushita Communication Industrial Co., Ltd., Kyushu Matsushita Electric Co., Ltd., Matsushita Seiko Co., Ltd. (currently Panasonic Ecology Systems Co., Ltd.), Matsushita Kotobuki Electronics Industries, Ltd.
and Matsushita Graphic Communication Systems, Inc. into wholly-owned subsidiaries through share-exchanges.
April, 2003 Established a joint venture cathode ray tubes manufacturing company, Matsushita Toshiba Picture Display Co., Ltd. (currently MT Picture Display Co., Ltd.) with Toshiba Corporation.
Made Matsushita Electronic Components Co., Ltd. and Matsushita Battery Industrial Co., Ltd. into wholly-owned subsidiaries through share-exchanges. Created a unified global brand, "Panasonic."
April, 2013 Transformed to new basic group formation through business division system from business domain system. Absorbed Panasonic Mobile Communications Co., Ltd. subsequent to carrying out the incorporation-type company split of mobile phone terminal business and transferring mobile phone base station business to Panasonic System Networks Co., Ltd. in the company split.Delisted from New York Stock Exchange.
March, 2014 Transferred all the shares and other related assets of Panasonic Healthcare Co., Ltd. to PHC Holdings Co., Ltd. and subscribed 20% of shares of PHC Holdings Co., Ltd.
June, 2014 Transferred semiconductor business to Panasonic Semiconductor Solutions Co., Ltd. in the company split.
The Panasonic Power CSP MOSFETs Introduction
Panasonic’s advanced 110 nm fine trench cell silicon technology
Image of Panasonic's Power CSP MOSFETsPanasonic, a worldwide leader in semiconductor products, announces the FJ3P02100L and FK3P02110L series of power CSP MOSFETs. The power CSP MOSFET series features Power Mount CSP Packaging (PMCP) that is comprised of a unique pad design and drain clip technology. This allows for a 5% improvement in thermal dissipation while simultaneously reducing the size by 80% over the conventional solutions. Panasonic’s advances in cell technology and wafer thinning fabrication have led to silicon with a 110 nm fine trench cell that provides 47% lower RDS(on) over the same sized conventional chip. By using this technology, this MOSFET series achieves higher power efficiency while reducing power consumption.
Panasonic FJ3P02100L and FK3P02110L Power CSP MOSFETs feature a unique Power Mount CSP package that allows for a 5% improvement in thermal dissipation while reducing the size by 80% over conventional solutions. The package structure consists of a unique pad design and drain clip technology for higher thermal performance. These Panasonic power MOSFET transistors employ a fine trench silicon technology that provides a 47% lower RDS(on) over the same-sized conventional chip. These Power CSP MOSFETs are optimized for load switches that combine low RDS(on) in a smaller form factor. The devices are also an ideal fit for Li-Ion battery applications in which low RDS(on) is necessary.Features
Power mount CSP (PMCP) package allows for improved thermal dissipation by 5% while reducing the size by 80% over the conventional solutions
Fine trench silicon technology provides 47% lower RDS(on) over the same sized conventional chip, achieving higher power efficiency while reducing power consumption of the system
Size: FJ3P02100L: 2.0 x 2.0 x 0.33 mm, FK3P02110L: 1.8 x 1.6 x 0.33 mm
RDS(on): FJ3P02100L: 9.5 mΩ at VGS=4.5 V (typ.), FK3P02110L: 12.5 mΩ at VGS=2.5 V (typ.)
Halogen free and RoHS qualified, with lead-free solder bumps
110nm fine trench cell with wafer thinning fabrication technology
ApplicationsLoad switches that combine low RDS(on) in a smaller form factor
Lithium ion battery applications where the low RDS(on) is a must