Meets industrial and automotive temperature requirement with the longest product life in the Market!!

Winbond introduced latest 2Gb DDR2 DRAM that not only meets industrial/automotive temperature requirement operating from -40°C (LT) to 95°C (AG3)/105°C(AG2)/115°C (AG2 plus) but also fully complies with AEC-Q100 qualification standards (the Stress Test Qualification for Integrated Circuits by Automotive Electronics Council). 

Among the key advantages of this new 2Gb DDR2 is long-term support for customers for more than 10 years, based on the longevity product commitment from Winbond. This ensures customers with continuous and reliable product delivery for long life applications such as industrial and automotive.

Winbond 2Gb DDR2 supports x8 FBGA-60 / x16 FBGA-84 IO interface. All of the BGA packages comply with ROHS standard as well as JGPSSI (Japan Green Procurement Survey Standardization Initiative) standard. It supports 333/400/533Mhz clock speed grade, which also fits perfectly for consumers electronics applications (0°C to 85°C) such as STB, High-end digital Camera, Networking and Printer applications.

• This product line also support KGD business

Winbond is one of the leading IDM Company which has capabilities of design, manufacturing and sales services. We focus on high performance and high quality products. Based on a 300 mm fab, Winbond keeps pace with the latest technologies to provide high-quality memory IC manufacturing services. Our goal is to maintain long-term relationships, provide prompt support and services to our customers from worldwide. In the future, Winbond will continue to provide customer-oriented services and concentrate our resources in markets with competitive edge.

About Winbond

Winbond Electronics Corporation is a worldwide leading supplier of specialty memory IC’s. The company provides memory solution backed by the expert capabilities of design, manufacturing and sales services.

Winbond’s product portfolio, consisting of Mobile DRAM, Specialty DRAM and Code Storage Flash, is widely used by tier-1 customers in consumer, communication, computer peripheral and automotive markets. Our 300 mm wafer fab keeps pace with advanced process technologies to provide high-quality memory IC products.

The Company was established in September 1987 and listed on Taiwan Stock Exchange in 1995 with headquarter in Central Taiwan Science Park, Taichung, Taiwan. Winbond also has subsidiaries in US, China, Israel, Japan and Hong Kong.

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