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Home > Storage technology > Inductive Sensor Interface IC leverages LVDT architecture on PCB.

Inductive Sensor Interface IC leverages LVDT architecture on PCB.

Published time: 2020-01-14 11:56:03

Inductive Sensor Interface IC leverages LVDT architecture on PCB.

As a Market Leader in Inductive Sensing Technology, Company Launches LX3302 for Demanding Automotive, Industrial and Commercial Aviation Applications.

ALISO VIEJO, Calif. – Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of a new device in its recently launched family of sensor interface integrated circuits (ICs) based upon inductive sensing technology, the LX3302. As the newest addition to the industry's first inductive sensor interface IC product family utilizing linear variable differential transformer (LVDT) architecture implementations on printed circuit boards (PCB), Microsemi's LX3302 is specially designed for applications within the automotive, industrial and commercial aviation markets.

Microsemi's LX3302 improves the LX3301A with an extended temperature range to 150 degrees Celsius, and a richer set of system interfaces which include analog sine/cosine outputs, single edge nibble transmission (SENT) and Peripheral Sensor Interfaces (PSI5), as well as the standard analog output and pulse width modulated (PWM) output. In addition, the LX3302 has double the EEPROM available in the LX3301A, allowing for eight-point calibration, versus six-point calibration, which increases system accuracy by 1-bit and permits less precise, lower cost sensor manufacturing. Leveraging Microsemi's expertise in inductive sensing technology and its more than five years' experience supplying customized ICs in production, the new device features LVDT principles, resulting in superior immunity to noise and interference.

"Microsemi is excited to expand our market opportunities with the LX3302, as our inductive sensing technology can replace the incumbent Hall-effect sensors, which are susceptible to external magnetic fields and/or metal objects in close proximity. Inductive technology eliminates the magnet, thereby improving immunity to such interference," said Shafy Eltoukhy, vice president and business unit manager at Microsemi. "Customers can use this emerging technology in a wide variety of mechanical motion sensing applications, as it provides significant improvement in temperature stability, reliability, safety and system costs."

As sensors are the key element in the feedback loop of virtually all closed loop systems, the LX3302 is ideal for a variety of applications related to control systems and industrial automation, including linear displacement measurement (fluid level sensing, gear position for transmission actuator position and brake lamp switch/proximity detection) and angular motion measurement (robotic arm position, rotating shaft position, pedal position and rotary controls). It also meets strict automotive application requirements, including AECQ100-certified grade 0, and comes with Production Part Approval Process (PPAP) documentation support. Microsemi's experienced automotive support team is also provided to ensure customer success with the product.

Additional features include:
--  Contactless sensing, ensuring high reliability
--  Internal temperature sensor
--  -40 to 150 degrees Celsius operating temperature/qualified to AEC-Q100 grade 0
--  Embedded pre-programmed, configurable microcontroller
--  Integrated oscillator and demodulator
--  Two independent sensor input channels with 13-bit analog-to-digital converters (ADCs)
--  Programmable sample rates to 2 kilohertz (kHz)
--  Input electromagnetic interference (EMI) filters
--  32 x 16 words of user programmable configuration EEPROM
--  Built-in diagnostics and ISO26262 compliance
--  Outputs: 0 to 5 volts (V) analog, PWM, analog sine/cosine, serial interfaces (SENT and PSI5)
--  Eight calibration segments (for shaping and output response)

The implementation of sensors continues to expand throughout the automotive and industrial markets. For example, according to MEMS Journal, the number of new light vehicles (cars and light trucks) shipped worldwide will grow from approximately 85 million in 2014 to 110 million by 2020. These vehicles currently feature an average of 60-100 sensors on board, but as cars are rapidly getting "smarter," the number of sensors is projected to reach as many as 200 sensors per car. This translates to approximately 22 billion sensors used in the automotive industry per year by 2020.

The LX3302 and other products in the LX33xx sensor IC family can be used with Microsemi's motor drive reference design utilizing the company's SmartFusion™2 system-on chip (SoC) field programmable gate array (FPGA) and a motor control IP suite to process the sensor inputs and motor drive algorithms. The sensor inputs can be connected to the motor control evaluation board.

About Microsemi's Automotive and Industrial Portfolio
Complementing its leadership in smart sensor interface technology, Microsemi is increasing its value as a systems solution provider with its new automotive-grade qualified SmartFusion2 and IGLOO™2 devices--offering advanced security and high reliability features critical for automotive applications. Microsemi's automotive and industrial portfolio also includes power discretes and modules, security software, Ethernet switches and PHYs, audio processors, Power-over-Ethernet (PoE), IEEE 1588 PLLs and software, clock management, component clocks, Wi-Fi RF ICs, and circuit protection devices.

About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

 

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