High-speed, backplane connector system is presented as future-proof

Molex (Lisle, IL) announced its Impel backplane connector system is available for use with the company’s Backplane Pin Map Configurator. This connector solution provides equipment manufacturers with the ability to have systems operate at today’s data-rates and costs, while providing a migration path for enhancements in the same chassis through Impel daughtercard options. The Impel connector system:

• Delivers low cross-talk and high density performance with data-rates up to 40 Gbps for next-generation backplane interconnect solutions. 
• Meets all critical architectural needs, including conventional, co-planar, orthogonal midplane and orthogonal direct.
• Is appropriate for telecommunications and data networking applications.

For more information, visit www.molex.com

Molex is a leading provider of complete interconnect products. With more than 33,000 highly skilled employees, Molex is committed to the design, development and distribution of innovative solutions for products that are relevant to people's lives. Focusing on the connector industry, Molex has more than 100,000 reliable products based on global resources, unique innovations and industry expertise to deliver products and services that meet the growing needs of customers worldwide. demand. Representing the world's largest product range, including electronic, electrical and fiber optic interconnect solutions, switches and application tools.

Tag: Communications Telecom/Datacom Industrial Newsletters

Previous: LED Driver ICs are optimized for high-line applications.

Next: Toshiba Develops Two New Process Technologies for Microcontrollers and Wireless Communication ICs