Grounding springs provide frame grounding between the pc board and chassis of mobile devices

Fujitsu Components America released a new series of grounding springs featuring a patented, robust structure and a wide working range for use in emerging mobile devices.

Measuring just 1.4 mm wide x 3.7 mm long, the FCN-118X grounding spring series is designed to provide frame grounding between the pc board and chassis of smart phones, tablet PCs, PDAs and other small mobile devices. A unique side-wing structure increases the spring’s rigidity and strength to resist deformation from applied outside force.

The spring may also be used as a 4A power contact between pc boards when mounted on the pc board artwork line and connected (contacted) to the other pc board for power line. Typically, a connector (some pins for power) is used for a power line connection between the pc boards, however, due to lack of current rating of the connector, the power line is separated and the spring is used instead.

Specifications of the FCN-118X include a 2.05mm initial height, a 0.80mm displacement, a 1.25 to 1.80mm working range and a 0.5 to 1.6N contact force. Custom designs are also possible.

Available immediately, the FCN-118X grounding spring series is available through your local Fujitsu sales representative.

 

us.fujitsu.com/components

Fujitsu's product line includes electromechanical relays, high-speed differential connectors, and resistive touch panels for a wide range of applications and industries. Fujitsu is committed to developing superior products. Strict quality-process standards has put the Fujitsu at the forefront of the latest technologies, backed by outstanding customer service.

Tag: Computing Consumer Newsletters

Share:

Previous: LED Driver ICs are optimized for high-line applications.

Next: MORNSUN Latest R3 DC/DC Converters Save Energy in Your Power System