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Home > Technology List > Cable tie/bundle product line now includes expandable sleeving

Cable tie/bundle product line now includes expandable sleeving

Update Time: 2019-12-20 05:11:20

Cable tie/bundle product line now includes expandable sleeving

NTE Electronics (Bloomfield, NJ) has expanded their cable tie/bundle management product line to now include expandable sleeving. This flame-retardant expandable sleeving is made of lightweight, self-fitting, braided polyester material that is designed to encase and protect wires and cables. The product is easy to install, lightweight, and allows flexibility while providing secure bundling for a professional look. With the ability to adjust to irregular surfaces, this high-quality sleeving provides abrasion resistance and protection while keeping the bundle size to its very minimum. Other features include:

  • Allows flexibility while providing secure bundling.
  • Packaged Lengths of 16.4 feet (5 meters).
  • RoHS compliance and UL approved.
  • Material: Flame Retardant Polyethylene Terephthalate (PET).
  • Working temperature range of −50 to +150 °C (−58 to +302 °F).
  • Melting point of +250 °C ±5 (+482 °F ±5 ).

For more information on the cable tie/bundle management product line, visit www.nteinc.com.

NTE was founded in 1979 and in 2001 acquired the ECG division of Philips N.A. NTE supplies aftermarket replacement parts for MRO (Maintenance, Repair and Operations) applications.Micron is one of the world's leading semiconductor companies. It is headquartered in Boise, Idaho, and incorporated under the laws of the state of Idaho in 1978. In 2008,Micron launches Aptina Imaging: a CMOS image sensor division. It continues leadership in energy-efficient memory designs with new low-voltage DDR3 and higher-density DDR2 parts. Intel and Micron are first to deliver a sub-40 nanometer NAND Flash memory device. And expands partnership with Nanya by acquiring Qimonda AG's stake in Inotera Memories, Inc.Then it won the Most Innovative NAND Process Technology—Semiconductor Insights Award.The next year it became the JEDEC Award for Technical Achievement in DDR3 and Module Standards.In that year Micron’s Chairman and CEO Steve Appleton and other Micron’s Chairman and CEO Steve Appleton met with President Obama in support of Economic Recovery Package.Micron Won Prestigious Semiconductor Insight Awards for DRAM and NAND Flash Technology Innovations. The Company has wholly owned wafer fabrication facilities in Boise, Idaho, Manassas, Virginia, Avezzano, Italy, and Nishiwaki City, Japan; wholly owned assembly and test operations in Boise, Idaho, Xi’an, China, and Singapore; and memory module assembly operations in Boise, Idaho, Singapore, East Kilbride, Scotland, and Aguadilla, Puerto Rico.They leverage Micron’s global operations to design and manufacture products and support customers around the world. The close coordination of research, manufacturing, and support functions helps they deliver high-quality products that meet their customers' requirements while achieving low cost production through decreased manufacturing cycle times and increased yields.At Jotrin you can find nearly any and every board-level electronic component, tool requirement and/or raw material all in one...

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