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Home > EDA/IC Design > ATMEL Component naming conventions and IC packaging

ATMEL Component naming conventions and IC packaging

Update Time: 2020-04-07 09:30:30

ATMEL Component naming conventions and IC packaging

ATMEL Component naming conventions

AT XX X XX XX  X    X

1         2   3  4    5   6 

1. Prefix: ATMEL company product code

2. Device Type

3. Speed

4. Package form:

A TQFP package

B ceramic brazed double in-line

C ceramic seal

D ceramic in-line

F flat package

G ceramic dual in-line, one-time programmable

J plastic J-lead chip carrier

K ceramic J-lead chip carrier

L leadless chip carrier

M ceramic module

N leadless chip carrier, one time programmable

P plastic in-line

Q plastic four-sided lead flat package

R Miniature Package Integrated Circuit

S miniature package integrated circuit

T Thin Miniature Package Integrated Circuit

U pin array

V Auto solder package

W chip

Y ceramic seal

Z ceramic multi-chip module

5. Temperature range:

C 0 ° C to 70 ° C,

I -40 ° C to 85 ° C,

M -55 ℃ to 125 ℃

6. Process:

Blank    standard

/ 883     Mil-Std-883, Fully Class B

B           Mil-Std-883, not class B

Atmel Corporation is a global leader in designing, manufacturing and marketing advanced semiconductors including microcontroller (MCU), programmable logic, and nonvolatile memory.

Tag: IC

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