Melexis' new generation QVGA ToF sensor chipset MLX75024 released at electronica
Published time: 2018-11-15
Melexis participated in the electronica 2018 in Munich,Germany(Booth 542, Hall B4).
At this electronica, Melexis announced that they upgraded its optical time-of-flight sensor–effectively a multi-pixel light-based radar–for in-vehicle use.
They used an interactive demonstration to highlight the new ToF chipset - the new device, the AEC-Q100 qualified MLX75024 at the electronica.
The MLX75024 is an upgraded version of the MLX75023. The new MLX75024 ToF QVGA sensor has doubled sensitivity compared to its predecessor, while its resolution (320 x 240 px) and ambient light tolerance remain at the same industry-leading level.
The sensor supports operation at lower brightness and reduces the required illumination power by at least 30%. The power consumption is reduced by 50%, the system efficiency is further improved, and the heating condition can be improved,the camera can also adopt a more compact design.
These new features allow designers to strike a balance between lighting power, accuracy and ambient light tolerance. Thanks to the above improvements, the SNR in low light conditions and one meter away is twice as high as before. The sensor also has a major improvement that integrates an on-chip temperature sensor to reduce system size and cost.
Before we understand the MLX75024, we need to understand the MLX75023
Overview of MLX75023
The MLX75023 is a QVGA (320 x 240 pixels) resolution optical time-of-flight (TOF) camera sensor. Combined with a modulated light source, this sensor is capable of measuring distance and reflectivity at full resolution.
The high dynamic range DepthSense™ TOF pixels support up to 120 klux background light. The sensor is available in a chip scale glass ball grid array (BGA) package and offers many integration possibilities.
Melexis' time-of-flight sensors enable robust 3D imaging solutions with minimal post-processing cost and large scalability of resolution, range and field-of-view.
Features and benefits of MLX75023
320 x 240 DepthSense™ TOF pixels
1/3” Sensor format (4.8 x 3.6 mm²)
High ambient light robustness
Spectral response in range 800-900 nm
Suitable for LED or laser illumination
Sensor modulation frequency up to 40 MHz
600 FPS raw image framerate
Small glass BGA package
Ambient temperature range: –40 to +105 °C
It is worth to mention that the MLX75023 launched by Melexis in 2014.It is the world's first in-vehicle time-of-flight sensor that meets the automotive industry standards and it can be installed in the car when it is produced.
Informations of MLX75024
The Gen 2 MLX75024 Time-Of-Flight sensor supports up to QVGA resolution with twice the sensitivity of the previous generation MLX75023. The MLX75123BA controls the Time-Of-Flight sensor, the illumination unit, and streams data to the host processor.
The chipset offers performance and flexibility, simplifies the design, and allows a very compact 3D camera.
The evaluation kit(EVK75024) is available to evaluate the MLX75024 and MLX75123 ToF chipset.
In the pipeline is a VGA sensor, based around a 13mm 640 x 480 backside illuminated sensor – initial sampling to automotive customers is shceduled for early 2019, together with the release of its evaluation kit.
It can be seen how important the launch of the MLX75024 is for Melexis.
In addition, in order to support the latest MLX75024 QVGA ToF sensor, Melexis has developed the MLX75123BA ToF companion chip, which has better front-end noise than the previous chip.
Futhermore,an MLX75123BA can support two MLX75024 sensors simultaneously, which further reduces system cost, complexity, and overall size of the dual-head ToF camera. Melexis has also developed a comprehensive evaluation kit (EVK75024) to support the new QVGA ToF chipset.
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