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XPEDITE7330

Intel Core i7 Processor-Based 3U Conduction- or Air-Cooled Compact PCI Module

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XPEDITE7330
Manufacturer :
Extreme Engineering Solutions (X-ES)
Datasheet :
XPEDITE7330 PDF
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XPEDITE7330
Extreme Engineering Solutions (X-ES)
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Estimated Delivery Time: Feb 27 - Mar 04 days (choose Expedited at checkout).
Manufacturer:
Extreme Engineering Solutions (X-ES)
Datasheet:
XPEDITE7330 PDF

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XPEDITE7330 Product Details

The XPedite7330 is a 3U conduction- or air-cooled CompactPCI (cPCI) single-board computer based on the Intel  Core i7 processor and Intel QM57 chipset. With dual cores operating at 2.53, 2.0, or 1.06 GHz, the Intel Core i7 delivers enhanced performance and efficiency for today's network information processing and other embedded computing applications. Complementing processor performance, the XPedite7330 features up to 8 GB of DDR3-1066 ECC SDRAM, PrPMC/XMC support and up to 16 GB of NAND flash. Two Gigabit Ethernet ports are routed to J2 for additional system flexibility. The XPedite7330 provides a high-performance, feature-rich solution for current and future generations of embedded applications. Operating system support packages for the XPedite7330 include Wind River VxWorks, QNX Neutrino, Green Hills INTEGRITY, and Linux.

Intel  CoreTMi7 Processor-Based 3U Conduction- or Air-Cooled CompactPCI Module

Intel CoreTMi7-610E, -620LE, and -620UE processors Dual-core with hyper-threading technology 3U CompactPCI module Conduction or air cooling of DDR3-1066 ECC SDRAM in two channels 32 MB NOR boot flash GB of NAND flash Configurable as system controller or peripheral Hosts a PrPMC or XMC Two 10/100/1000BASE-T Ethernet ports out J2 Two RS-232/422/485 serial ports out J2 Front I/O available via plugover module Linux BSP Wind River VxWorks BSP QNX Neutrino BSP Green Hills INTEGRITY BSP Microsoft Windows Drivers

The a 3U conduction- or air-cooled CompactPCI (cPCI) single-board computer based on the Intel CoreTMi7 processor and Intel QM57 chipset. With dual cores operating or 1.06 GHz, the Intel CoreTMi7 delivers enhanced performance and efficiency for today's network information processing and other embedded computing applications. Complementing processor performance, the XPedite7330 features of DDR3-1066 ECC SDRAM, PrPMC/XMC support and GB of NAND flash. Two Gigabit Ethernet ports are routed to J2 for additional system flexibility. The XPedite7330 provides a high-performance, feature-rich solution for current and future generations of embedded applications. Operating system support packages for the XPedite7330 include Wind River VxWorks, QNX Neutrino, Green Hills INTEGRITY, and Linux.

Extreme Engineering Solutions 3225 Deming Way, Suite 120 Middleton, WI 53562 Phone: 608.833.1155 Fax: 608.827.6171 sales@xes-inc.com http://www.xes-inc.com

Intel CoreTMi7 processor operating or 1.06 GHz Dual-core with hyper-threading technology Intel QM57 chipset Dual channel integrated memory controller Integrated graphics controller MB of shared cache

Two 10/100/1000Base-T Ethernet ports Two RS-232/422/485 serial ports Four GPIO signals Four SATA ports Two USB 2.0 ports One DVI port

Linux BSP Wind River VxWorks BSP QNX Neutrino BSP Green Hills INTEGRITY BSP Microsoft Windows Drivers

32-bit, 33-MHz PCI bus (PMC interface) x8 PCIe port (XMC interface) 3U conduction- or air-cooled CompactPCI form factor Dimensions: 160 mm of DDR3-1066 ECC SDRAM on two channels 32 MB NOR boot flash GB of NAND flash.

Front-panel RS-232, USB, SATA, and DVI ports available via optional plugover module Contact factory for appropriate board configuration based on environmental requirements. Supported ruggedization levels (see chart below): 3, 5 Conformal coating available as an ordering option 32-bit PCI interface operating or 66 MHz System controller capable with onboard clocking and arbitration Peripheral slot capable.

Supported Ruggedization Level Cooling Method Operating Temperature Storage Temperature Vibration Shock Humidity.

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