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XC7K355T-3FFG901E

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FPGA, Kintex-7, MMCM, PLL, 300 I/O's, 741 MHz, 356160 Cells, 970 mV to 1.03 V, FCBGA-901

  • Package/Case :
  • 900-BBGA, FCBGA
  • Product Categories :
  • Embedded - FPGAs (Field Programmable Gate Array)
  • RoHs Status:
  • Lead free / RoHS Compliant
  • In-stock:
  • 105

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XC7K355T-3FFG901E Product Details

Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:

  • Artix®-7 Family: Optimized for lowest cost and power with small form-factor packaging for the highest volume applications.
  • Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.
  • Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology.

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.

XC7K355T-3FFG901E

Feature

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
  • High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
  • Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.

Technical Parameters

  • Number of LABs/CLBs
  • 27825
  • Number of Logic Elements/Cells
  • 356160
  • Total RAM Bits
  • 26357760
  • Number of I/O
  • 300
  • Voltage Supply
  • 0.97V ~ 1.03V
  • Mounting Type
  • Surface Mount
  • Operating Temperature
  • 0??C ~ 100??C (TJ)
  • Package / Case
  • 900-BBGA, FCBGA
  • Supplier Device Package
  • 901-FCBGA (31x31)

XC7K355T-3FFG901E Documents

  • XC7K355T Technical Support PDF Datasheet Overview

XC7K355T-3FFG901E Related Products

Ratings and Reviews (1)

  • 5 / 5
  • 5 Stars 100%
  • 4 Stars 0%
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  • 1 Stars 0%
  • **MD I***
    2019-12-16

    AS described, supper fast shipping, two thumbs up!

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    90 days quality guarantee for all products.

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1.We provide 90 days warranty.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

FAQ:

Q: How does Jotrin guarantee that XC7K355T-3FFG901E is the original manufacturer or agent of XILINX?
We have a professional business development department to strictly test and verify the qualifications of XILINX original manufacturers and agents. All XILINX suppliers must pass the qualification review before they can publish their XC7K355T-3FFG901E devices; we pay more attention to the channels and quality of XC7K355T-3FFG901E products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.
Q: How to find the detailed information of XC7K355T-3FFG901E chips? Including XILINX original factory information, Embedded - FPGAs (Field Programmable Gate Array) application, XC7K355T-3FFG901E pictures?
You can use Jotrin's intelligent search engine, or filter by Kintex-7 FPGAs category, or find it through Xilinx, Inc Information page.
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Q: What is the process for returns or replacement of XC7K355T-3FFG901E?
All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7K355T3FFG901E we delivered, we will accept the replacement or return of the XC7K355T-3FFG901E only when all of the below conditions are fulfilled:
(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.
(2)We are informed of the defect described above within 90 days after the delivery of XC7K355T-3FFG901E.
(3)The XC7K355T-3FFG901E is unused and only in the original unpacked packaging.
Two processes to return the products:
(1)Inform us within 90 days
(2)Obtain Requesting Return Authorizations
More details about return electronic components please see our Return & Change Policy.
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Xilinx, Inc

Xilinx
Xilinx is the inventor of the FPGA, CPLDs, programmable SoCs, and now, the ACAP, their highly-flexible programmable silicon, enabled by a suite of advanced software and tools, drives rapid innovation across a wide span of industries and technologies - from consumer to cars to the cloud....

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