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FPGA Artix-7 Family 215360 Cells 28nm Technology 1V 484Pin FCBGA
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XC7A200T-2FBG484C Product Details
Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:
- Artix®-7 Family: Optimized for lowest cost and power with small form-factor packaging for the highest volume applications.
- Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.
- Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
- Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
- 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
- High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
- High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
- A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
- DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
- Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
- Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
- Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
- Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
- Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
- Number of LABs/CLBs
- Number of Logic Elements/Cells
- Total RAM Bits
- Number of I/O
- Voltage Supply
- 0.95V ~ 1.05V
- Mounting Type
- Surface Mount
- Operating Temperature
- 0??C ~ 85??C (TJ)
- Package / Case
- 484-BBGA, FCBGA
- Supplier Device Package
- 484-FCBGA (23x23)
XC7A200T Technical Support PDF Datasheet Overview
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1.We provide 90 days warranty.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
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All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment.
If there is something wrong with the XC7A200T2FBG484C we delivered, we will accept the replacement or return of the XC7A200T-2FBG484C only when all of the below conditions are fulfilled:
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(3)The XC7A200T-2FBG484C is unused and only in the original unpacked packaging.
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- 1.About the Spartan-7 of Xilinx FPGA Family
- 2.Xilinx FPGA naming conventions
- 3.Xilinx-FPGA DNA reading method
- 4.Xilinx-7Series-FPGA high-speed transceiver use learning
- 5.FPGAs, 3D ICs, and MPSoCs suit LTE Advanced applications
- 6.Development Environment supports SoCs and MPSoCs.
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