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  • XC4013E-2PG223I
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XC4013E-2PG223I

Field Programmable Gate Array (FPGA)

  • Package/Case :
  • 223-BCBGA
  • Product Categories :
  • Socle de fusible
  • RoHs Status:
  • Lead free/RoHS Compliant
  • In-stock:
  • 260

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XC4013E-2PG223I Product Details

Definition of Terms

In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as follows:

Advance:Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or device families. Values are subject to change. Use as estimates, not for production.

Preliminary:Based on preliminary characterization. Further changes are not expected.

Unmarked:Specifications not identified as either Advance or Preliminary are to be considered Final.

Except for pin-to-pin input and output parameters, the a.c. parameter delay specifications included in this document are derived from measuring internal test patterns. All specifications are representative of worst-case supply voltage and junction temperature conditions.

All specifications subject to change without notice.

XC4013E-2PG223I

Feature

Absolute Maximum Ratings

 Description UnitsVCCSupply voltage relative to Ground-0.5 to 4.0VVINInput voltage relative to Ground (Note 1)-0.5 to 5.5VVTSVoltage applied to 3-state output (Note 1)-0.5 to 5.5VVCCtLongest Supply Voltage Rise Time from 1 V to 3V50msTSTGStorage temperature (ambient)-65 to +150°CTSOLMaximum soldering temperature (10 s @ 1/16 in. = 1.5 mm)+260°CTJJunction TemperatureCeramic packages+150°CPlastic packages+125°C

Note 1: Maximum DC excursion above Vcc or below Ground must be limited to either 0.5 V or 10 mA, whichever is easier to achieve. During transitions, the device pins may undershoot to -2.0 V or overshoot toVCC +2.0 V, provided this over or undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA.

Note: Stresses beyond thouse listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond thouse listed under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability

Recommended Operating Conditions

SymbolDescriptionMinMaxUnitsVCCSupply voltage relative to Gnd, TJ = 0 °C to +85°CCommercial3.03.6VSupply voltage relative to Gnd, TJ = -40°C to +100°CIndustrial3.03.6VVIHHigh-level input voltage50% of VCC5.5MaxVVILLow-level input voltage030% of VCCVTINInput signal transition time 250ns

Notes: At junction temperatures above thouse listed above, all delay parameters increase by 0.35% per °C. Input and output measurement threshold is ~50% of VCC.

Technical Parameters

  • Number of LABs/CLBs
  • 576
  • Number of Logic Elements/Cells
  • 1368
  • Total RAM Bits
  • 18432
  • Number of I/O
  • 192
  • Number of Gates
  • 13000
  • Voltage Supply
  • 4.5V ~ 5.5V
  • Mounting Type
  • Through Hole
  • Operating Temperature
  • -40??C ~ 100??C (TJ)
  • Package / Case
  • 223-BCPGA
  • Supplier Device Package
  • 223-CPGA (47.25x47.25)

XC4013E-2PG223I Documents

  • XC4013E Technical Support PDF Datasheet Overview

XC4013E-2PG223I Related Products

Ratings and Reviews (1)

  • 5 / 5
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  • **oham***
    2020-03-28

    All Good,good price,good package,good despatch, Thanks. :-)

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Xilinx, Inc

Xilinx
Xilinx is the inventor of the FPGA, CPLDs, programmable SoCs, and now, the ACAP, their highly-flexible programmable silicon, enabled by a suite of advanced software and tools, drives rapid innovation across a wide span of industries and technologies - from consumer to cars to the cloud....
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