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UDN2916EBTR-T

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ALLEGRO 4.75V ~ 5.25V DUAL FULL-BRIDGE PWM MOTOR Driver ICs.

Models#:
UDN2916EBTR-T
Manufacturer :
Package/Case :
PLCC44
Datasheet :
UDN2916EBTR-T PDF
Minimum :
1
Quantity:
Stock : 90
  • 1-9
  • 10-49
  • 50-99
  • 100-249
  • 500-999
  • ›=1000
UDN2916EBTR-T PLCC44
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Estimated Delivery Time: Jul 22 - Jul 27 days (choose Expedited at checkout).
Manufacturer:
ALLEGRO
Package/Case:
PLCC44
Datasheet:
UDN2916EBTR-T PDF
Life Cycle:
Obsoleted

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Specifications

Part Status Obsolete
Motor Type Stepper Bipolar
Motor Type AC, DC Brushed DC
Function Driver - Fully Integrated, Control and Power Stage
Output Configuration Half Bridge (4)
Interface Parallel
Technology Bipolar
Step Resolution -
Applications General Purpose
Current Output 750mA
Voltage Supply 4.75V ~ 5.25V
Voltage Load 10 V ~ 45 V
Operating Temperature -20°C ~ 150°C (TJ)
Mounting Type Surface Mount
Package / Case 44-LCC (J-Lead)
Supplier Device Package 44-PLCC (16.59x16.59)
Base Part Number UDN2916

Product Details

The UDx2916 motor drivers drive both windings of a bipolar stepper motor or bidirectionally control two DC motors. Both bridges are capable of sustaining 45 V and include internal pulse-width modulation (PWM) control of the output current to 750 mA. The outputs have been optimized for a low output saturation voltage drop (less than 1.8 V total source plus sink at 500 mA).
For PWM current control, the maximum output current is determined by user selection of a reference voltage and sensing resistor. Two logic-level inputs select output current limits of 0%, 33%, 67%, or 100% of the maximum level. A PHASE input to each bridge determines load current direction.
The bridges include both ground-clamp and flyback diodes for protection against inductive transients. Internally generated delays prevent crossover currents when switching current direction. Special power-up sequencing is not required. Thermal protection circuitry disables the outputs if the chip temperature exceeds safe operating limits.

The device is supplied in a 24-pin dual in-line plastic (DIP, package B) with two pairs of batwing leads as heat-sinkable tabs for enhanced power dissipation capabilities. The LB package is a 24-lead surface-mount wide SOIC with two pairs

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