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MPU, 32BIT, 650MHZ, -40 TO 125DEG C New
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STM32MP157CAC3 Product Details
The STM32MP157C/F devices are based on the high-performance dual-core Arm® Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.
The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON?, and 128-bit AMBA®4 AXI bus interface.
The STM32MP157C/F devices also embed a Cortex® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions and data types. The Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32MP157C/F devices also embed a 3D graphic processing unit (Vivante® - OpenGL® ES 2.0) running at up to 533 MHz, with performances up to 26 Mtriangle/s, 133 Mpixel/s.
The STM32MP157C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
The STM32MP157C/F devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.
All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.
- 32-bit dual-core Arm Cortex-A7
- L1 32-Kbyte I / 32-Kbyte D for each core
- 256-Kbyte unified level 2 cache
- Arm NEON and Arm TrustZone
- 32-bit Arm Cortex-M4 with FPU/MPU
- Up to 209 MHz (Up to 703 CoreMark)
- External DDR memory up to 1 Gbyte
- up to LPDDR2/LPDDR3-1066 16/32-bit
- up to DDR3/DDR3L-1066 16/32-bit
- 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
- Dual mode Quad-SPI memory interface
- Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
- Secure boot, TrustZone peripherals, active tamper
- Cortex-M4 resources isolation
- 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
- POR, PDR, PVD and BOR
- On-chip LDOs (RETRAM, BKPSRAM, DSI 1.2 V, USB 1.8 V, 1.1 V)
- Backup regulator (~0.9 V)
- Internal temperature sensors
- Low-power modes: Sleep, Stop and Standby
- DDR memory retention in Standby mode
- Controls for PMIC companion chip
- Total current consumption down to 2 μA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
- Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
- External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
- 6 × PLLs with fractional mode
- Up to 176 I/O ports with interrupt capability
- Up to 8 secure I/Os
- Up to 6 Wakeup, 3 tampers, 1 active tamper
- 2 bus matrices
- 64-bit Arm AMBA AXI interconnect, up to 266 MHz
- 32-bit Arm AMBA AHB interconnect, up to 209 MHz
- 48 physical channels in total
- 1 × high-speed general-purpose master direct memory access controller (MDMA)
- 2 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
- Core Processor
- ARM? Cortex?-A7
- Number of Cores/Bus Width
- 2 Core, 32-Bit
- 209MHz, 650MHz
- Co Processors/DSP
- ARM? Cortex?-M4
- RAM Controllers
- LPDDR2, LPDDR3, DDR3, DDR3L
- Graphics Acceleration
- Display & Interface Controllers
- HDMI, LCD
- 10/100Mbps (1)
- USB 2.0 (2), USB 2.0 OTG+ PHY (3)
- Voltage I/O
- 2.5V, 3.3V
- Operating Temperature
- -40??C ~ 125??C (TA)
- Security Features
- ARM TZ
- Package / Case
- Supplier Device Package
- 361-TFBGA (12x12)
STM32MP157CAC3 Related Products
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Estimated Delivery Time: Aug 17 - Aug 22 days (choose Expedited at checkout).
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1.We provide 90 days warranty.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
- Q: How does Jotrin guarantee that STM32MP157CAC3 is the original manufacturer or agent of ST?
- We have a professional business development department to strictly test and verify the qualifications of ST original manufacturers and agents. All ST suppliers must pass the qualification review before they can publish their STM32MP157CAC3 devices; we pay more attention to the channels and quality of STM32MP157CAC3 products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.
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- You can use Jotrin's intelligent search engine, or filter by STM32 Arm Cortex MPUs ; STM32MP1 Series ; STM32MP151 category, or find it through STMicroelectronics, Inc Information page.
- Q: Are the ST's STM32MP157CAC3 price and stock displayed on the platform accurate?
- The ST's inventory fluctuates greatly and cannot be updated in time, it will be updated periodically within 24 hours. After submitting an order for STM32MP157CAC3, it is recommended to confirm the order with Jotrin salesperson or online customer service before payment.
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- Q: What is the process for returns or replacement of STM32MP157CAC3?
All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment.
If there is something wrong with the STM32MP157CAC3 we delivered, we will accept the replacement or return of the STM32MP157CAC3 only when all of the below conditions are fulfilled:
(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.
(2)We are informed of the defect described above within 90 days after the delivery of STM32MP157CAC3.
(3)The STM32MP157CAC3 is unused and only in the original unpacked packaging.
Two processes to return the products:
(1)Inform us within 90 days
(2)Obtain Requesting Return Authorizations
More details about return electronic components please see our Return & Change Policy.
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