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  • PC28F256P30B85

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Intel StrataFlash Embedded Memory

  • Package/Case :
  • BGA64
  • Product Categories :
  • Memory chips
  • RoHs Status:
  • Lead free / RoHS Compliant
  • In-stock:
  • 25


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PC28F256P30B85 Product Details

This document provides information about the Intel StrataFlash® Embedded Memory (P30) device and describes its features, operation, and specifications.Product



High performance    85/88 ns initial access    40 MHz with zero wait states, 20 ns clock-to data output synchronous-burst read mode    25 ns asynchronous-page read mode    4-, 8-, 16-, and continuous-word burst mode    Buffered Enhanced Factory Programming (BEFP) at 5 μs/byte (Typ)    1.8 V buffered programming at 7 μs/byte (Typ) Architecture    Multi-Level Cell Technology: Highest Density at Lowest Cost    Asymmetrically-blocked architecture    Four 32-KByte parameter blocks: top or bottom configuration    128-KByte main blocks Voltage and Power    VCC(core) voltage: 1.7 V 2.0 V    VCCQ (I/O) voltage: 1.7 V 3.6 V    Standby current: 55 μA (Typ) for 256-Mbit    4-Word synchronous read current: 13 mA (Typ) at 40 MHz Quality and Reliability    Operating temperature: 40 ℃ to +85 ℃        1-Gbit in SCSP is 30 ℃ to +85 ℃    Minimum 100,000 erase cycles per block    ETOX VIII process technology (130 nm) Security    One-Time Programmable Registers:        64 unique factory device identifier bits        64 user-programmable OTP bits        Additional 2048 user-programmable OTP bits    Selectable OTP Space in Main Array:        4x32KB parameter blocks + 3x128KB main blocks (top or bottom configuration)    Absolute write protection: VPP= VSS    Power-transition erase/program lockout    Individual zero-latency block locking    Individual block lock-down Software    20 μs (Typ) program suspend    20 μs (Typ) erase suspend    Intel® Flash Data Integrator optimized    Basic Command Set and Extended Command Set compatible    Common Flash Interface capable Density and Packaging    64/128/256-Mbit densities in 56-Lead TSOP package    64/128/256/512-Mbit densities in 64-Ball Intel®Easy BGA package    64/128/256/512-Mbit and 1-Gbit densities in Intel®QUAD+ SCSP    16-bit wide data bus

Technical Parameters

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  • Packing
  • Tape & Reel (TR)/Cut Tape (CT)/Tray/Tube
  • RoHs Status
  • Lead free / RoHS Compliant
  • Package/Case
  • BGA64

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Estimated Delivery Time: Jul 02 - Jul 07 days (choose Expedited at checkout).

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We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

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1.We provide 90 days warranty.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.


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Micron is one of the world's leading semiconductor companies. Micron ranked as one of the top semiconductor innovators in quantity and strength of patents by The Patent Board. Micron often accomplishes this optimization through partnerships with other manufacturers and enablers, making it easier for...

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