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MPC8270CVVUPEA

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PowerQUICC, 32 Bit Power Architecture, 450MHz, Comms Processor, PCI, USB, HDLC, Enet, -40 to 105C

Manufacturer : NXP Semiconductor
Package/Case : TBGA-480
Product Categories : Microcontrollers (MPU),
Datasheet: MPC8270CVVUPEA Datasheet (PDF)
RoHs Status: Rohs
In-stock: 3000

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MPC8270CVVUPEA Product Details

Introducing the next generation of PowerQUICC® II™ processors: the MPC8270, MPC8275 and MPC8280.

Utilizing Our HiPerMOS7 0.13-micron process technology, the next generation PowerQUICC II family offers a range of performance, feature enhancements and package options with lower power requirements. Ideal for wired and wireless infrastructure communications processing tasks, enhancements to the PowerQUICC II family offer system designers a high degree of integrated features and functionality and a compelling, proven architecture.

The next generation of PowerQUICC II processors is an optimum solution for integrated control and forwarding plane processing in high-end communications and networking equipment -- such as routers, DSLAMs, remote access concentrators, telecom switching equipment and cellular base stations. Combining extensive layer 2 functionality with control plane processing, Our PowerQUICC II processors include a high-performance embedded 603e™ core built on Power Architecture technology, and a powerful RISC-based Communications Processor Module (CPM). The CPM off-loads peripheral tasks from the embedded Power Architecture core and provides support for multiple communications protocols including 10/100Mbps Ethernet, 155Mbps ATM and 256 HDLC channels. And, of course, the next generation PowerQUICC II devices retain full software compatibility with the PowerQUICC II family.

A range of performance and package options

Taking advantage of the 0.13-micron process, the next generation of PowerQUICC II devices offers significant performance increases and power savings over the current generation PowerQUICC II devices, with speeds of up to 450MHz and 300MHz in the core and CPM respectively at less than 2 watts. The new processors continue to enhance the PowerQUICC architecture's industry-leading ATM support, offering up to 2 UTOPIA ports with support for up to 31 PHYs per interface -- ideal for high-density DSLAM line cards.

The next generation of PowerQUICC II solutions also delivers support for USB, an on-target addition for high performance SOHO and CPE networking equipment. And unlike most other integrated communications processors in the market, the PowerQUICC architecture integrates two processing cores to handle specific tasks: the core built on Power Architecture technology and the RISC-based CPM -- enabling a balanced approach for systems by handling both high-level tasks and low-level communications all in one integrated device.

MPC8270CVVUPEA

Feature

  • 603e core with 16K inst and 16K data caches
  • 64-bit 60x bus, 32-bit PCI/local bus
  • 128K ROM, 32K IRAM, 32K DPRAM
  • Three FCCs for 10/100 Ethernet
  • 128 HDLC channels, 4 TDMs
  • 4 SCCs, 2 SMCs, SPI, I2C
  • Memory controller built from SDRAM, UPM, GPCM machines
  • New features -- USB, RMII
  • Performance
    • 266 MHz CPU, 200 MHz CPM, 66 MHz bus
    • ~ 1W @ full performance, 1.5V
  • Technology
    • HIP7AP .13 micron, 3.3V I/O, 1.5V Core
    • 516 PBGA, 27x27mm, 1mm ball pitch
      • ZQ package has lead-bearing spheres
      • VR package is lead-free

MPC8270ZU (480 TBGA) Features

  • 603e core with 16K inst and 16K data caches
  • 64-bit 60x bus, 32-bit PCI bus
  • 128K ROM, 32K IRAM, 32K DPRAM
  • Three FCCs for 10/100 Ethernet
  • 128 HDLC channels, 4 TDMs
  • 4 SCCs, 2 SMCs, SPI, I2C
  • Memory controller built from SDRAM, UPM, GPCM machines
  • New features -- USB, RMII
  • Performance
    • 333 MHz CPU, 250 MHz CPM, 83 MHz bus
    • 450 MHz CPU, 300 MHz CPM, 100 MHz bus
    • Less than 2W @ full performance, 1.5V
  • Technology
    • HIP7AP, 3.3V I/O, 1.5V Core
    • 480 TBGA, 37.5x37.5mm, 1.27mm ball pitch

MPC8270CVVUPEA Products

Technical Parameters

  • Core
  • 603e
  • Data Bus Width
  • 32 bit
  • Maximum Clock Frequency
  • 450 MHz
  • Program Memory Size
  • 16 KB
  • Data RAM Size
  • 32 KB
  • Interface Type
  • I2C, SPI, UART
  • Operating Supply Voltage
  • 0 V to 3 V
  • Maximum Operating Temperature
  • + 105 C
  • Mounting Style
  • SMD/SMT
  • Package / Case
  • TBGA-480
  • Data ROM Size
  • 16 KB
  • I/O Voltage
  • 3.3 V
  • Minimum Operating Temperature
  • 0 C
  • Packaging
  • Tray
  • Processor Series
  • MPC8xxx
  • Factory Pack Quantity
  • 21
  • Tradename
  • PowerQUICC

MPC8270CVVUPEA Datasheet

MPC8270CVVUPEA Related Products

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  • **arti***
    2020-01-06

    Fast Shipment Highly Recommended

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2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

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Q: How does Jotrin guarantee that MPC8270CVVUPEA is the original manufacturer or agent of NXP?
We have a professional business development department to strictly test and verify the qualifications of NXP original manufacturers and agents. All NXP suppliers must pass the qualification review before they can publish their MPC8270CVVUPEA devices; we pay more attention to the channels and quality of MPC8270CVVUPEA products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.
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You can use Jotrin's intelligent search engine, or filter by Processors and Microcontrollers ; Legacy MCU/MPUs ; PowerQUICC Processors; category, or find it through NXP Semiconductor Information page.
Q: Are the NXP's MPC8270CVVUPEA price and stock displayed on the platform accurate?
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Q: What is the process for returns or replacement of MPC8270CVVUPEA?
All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the MPC8270CVVUPEA we delivered, we will accept the replacement or return of the MPC8270CVVUPEA only when all of the below conditions are fulfilled:
(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.
(2)We are informed of the defect described above within 90 days after the delivery of MPC8270CVVUPEA.
(3)The MPC8270CVVUPEA is unused and only in the original unpacked packaging.
Two processes to return the products:
(1)Inform us within 90 days
(2)Obtain Requesting Return Authorizations
More details about return electronic components please see our Return & Change Policy.
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NXP Semiconductor

NXP
NXP Semiconductors delivers secure connectivity and infrastructure products for a smarter world, bringing solutions that make life easier, better and safer. As the world leader in secure connection solutions for embedded applications, NXP has been driving innovation in securely connected automotive...
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