Products > Integrated Circuits (ICs) > Embedded Processors & Controllers > LPC1812JBD144E
LPC1812JBD144E SOT486
  • LPC1812JBD144E
  • LPC1812JBD144E 0
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MCU 32Bit LPC1800 ARM Cortex M3 RISC 512KB Flash 3.3V 144Pin LQFP Tray

Manufacturer :
NXP Semiconductor
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LPC1812JBD144E Product Details

The LPC185x/3x/2x/1x are Arm Cortex-M3 based microcontrollers for embeddedapplications. The Arm Cortex-M3 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.

The LPC185x/3x/2x/1x operate at CPU frequencies of up to 180 MHz. The ArmCortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals. The ArmCortex-M3 CPU also includes an internal prefetch unit that supports speculativebranching.

The LPC185x/3x/2x/1x include up to 1 MB of flash and 136 kB of on-chip SRAM, 16 kB ofEEPROM memory, a quad SPI Flash Interface (SPIFI), a State Configurable Timer (SCT)subsystem, two High-speed USB controllers, Ethernet, LCD, an external memorycontroller, and multiple digital and analog peripherals.


  • Processor core
    • Arm Cortex-M3 processor, running at CPU frequencies of up to 180 MHz
    • Arm Cortex-M3 built-in Memory Protection Unit (MPU) supporting eight regions
    • Arm Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC)
    • Non-maskable Interrupt (NMI) input
    • JTAG and Serial Wire Debug, serial trace, eight breakpoints, and four watch points
    • Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support
    • System tick timer
  • On-chip memory
    • Up to 1 MB on-chip dual bank flash memory with flash accelerator
    • 16 kB on-chip EEPROM data memory
    • 136 kB SRAM for code and data use
    • Multiple SRAM blocks with separate bus access
    • 64 kB ROM containing boot code and on-chip software drivers
    • 64 bit of One-Time Programmable (OTP) memory for general-purpose use
  • Clock generation unit
    • Crystal oscillator with an operating range of 1 MHz to 25 MHz
    • 12 MHz internal RC oscillator trimmed to 2 % accuracy over temperature andvoltage (1 % accuracy for Tamb = 0 °C to 85 °C)
    • Ultra-low power RTC crystal oscillator
    • Three PLLs allow CPU operation up to the maximum CPU rate without the need fora high-frequency crystal. The second PLL can be used with the High-speed USB,the third PLL can be used as audio PLL
    • Clock output
  • Configurable digital peripherals
    • State Configurable Timer (SCT) subsystem on AHB
    • Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs andoutputs to event driven peripherals like timers, SCT, and ADC0/1
  • Serial interfaces
    • Quad SPI Flash Interface (SPIFI) with 1-, 2-, or 4-bit data at rates of up to52 MB per second
    • 10/100T Ethernet MAC with RMII and MII interfaces and DMA support for highthroughput at low CPU load. Support for IEEE 1588 time stamping/advanced timestamping (IEEE 1588-2008 v2)
    • One High-speed USB 2.0 Host/Device/OTG interface with DMA support andon-chip high-speed PHY (USB0)
    • One High-speed USB 2.0 Host/Device interface with DMA support, on-chipfull-speed PHY and ULPI interface to an external high-speed PHY (USB1)
    • USB interface electrical test software included in ROM USB stack
    • Four 550 UARTs with DMA support: one UART with full modem interface; oneUART with IrDA interface; three USARTs support UART synchronous mode and asmart card interface conforming to ISO7816 specification
    • Up to two C_CAN 2.0B controllers with one channel each. Use of C_CAN controllerexcludes operation of all other peripherals connected to the same bus bridge
    • Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMAsupport
    • One Fast-mode Plus I²C-bus interface with monitor mode and with open-drain I/Opins conforming to the full I²C-bus specification. Supports data rates of up to1 Mbit/s
    • One standard I²C-bus interface with monitor mode and standard I/O pins
    • Two I²S interfaces with DMA support, each with one input and one output
  • Digital peripherals
    • External Memory Controller (EMC) supporting external SRAM, ROM, NOR flash,and SDRAM devices
    • LCD controller with DMA support and a programmable display resolution of up to1024H x 768V. Supports monochrome and color STN panels and TFT color panels;supports 1/2/4/8 bpp Color Look-Up Table (CLUT) and 16/24-bit direct pixelmapping
    • SD/MMC card interface
    • Eight-channel General-Purpose DMA controller can access all memories on theAHB and all DMA-capable AHB slaves
    • Up to 164 General-Purpose Input/Output (GPIO) pins with configurablepull-up/pull-down resistors
    • GPIO registers are located on the AHB for fast access. GPIO ports have DMAsupport
    • Up to eight GPIO pins can be selected from all GPIO pins as edge and levelsensitive interrupt sources
    • Two GPIO group interrupt modules enable an interrupt based on a programmablepattern of input states of a group of GPIO pins
    • Four general-purpose timer/counters with capture and match capabilities
    • One motor control PWM for three-phase motor control
    • One Quadrature Encoder Interface (QEI)
    • Repetitive Interrupt timer (RI timer)
    • Windowed watchdog timer
    • Ultra-low power Real-Time Clock (RTC) on separate power domain with 256 bytesof battery powered backup registers
    • Event recorder with three inputs to record event identification and event time; canbe battery powered
    • Alarm timer; can be battery powered
  • Analog peripherals
    • One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s
    • Two 10-bit ADCs with DMA support and a data conversion rate of 400 kSamples/s.Up to eight analog channels total. Each analog input is connected to both ADCs
  • Unique ID for each device
  • Power
    • Single 3.3 V (2.2 V to 3.6 V) power supply with on-chip internal voltage regulator forthe core supply and the RTC power domain
    • RTC power domain can be powered separately by a 3 V battery supply
    • Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deeppower-down
    • Processor wake-up from Sleep mode via wake-up interrupts from variousperipherals
    • Wake-up from Deep-sleep, Power-down, and Deep power-down modes viaexternal interrupts and interrupts generated by battery powered blocks in the RTCpower domain
    • Brownout detect with four separate thresholds for interrupt and forced reset
    • Power-On Reset (POR)
  • Available in LQFP208, LBGA256, LQFP144, and TFBGA100 packages
Target Applications
  • Industrial
  • Consumer
  • White goods
  • RFID readers
  • e-Metering

Technical Parameters

Power Dissipation 1500 mW Mounting Style Surface Mount
Product Lifecycle Status Active Case/Package SOT486
Packaging Tray RoHS Compliant

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