EU80569PJ073N

Intel� CoreTM2 Extreme Processor QX9000 Series, Intel� CoreTM2 Quad Processor Q9000S, Q8000, and Q8000S Series

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL� PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. The Intel� CoreTM2 Extreme processor QX9000 series and Intel� CoreTM2 Quad processor Q9000S, Q8000, and Q8000S series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details. Intel� 64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel 64. Processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and software configurations. See http://www.intel.com/info/em64t for more information including details on which processors support Intel 64, or consult with your system vendor for more information. Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Virtualization Technology requires a computer system with an enabled Intel� processor, BIOS, virtual machine monitor (VMM) and, for some uses, certain platform software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor. No computer system can provide absolute security under all conditions. Intel� Trusted Execution Technology (Intel� TXT) requires a computer system with Intel� Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible measured launched environment (MLE). The MLE could consist of a virtual machine monitor, or an application. In addition, Intel TXT requires the system to contain a TPM v1.2, as defined by the Trusted Computing Group and specific software for some uses. For more information, see http://www.intel.com/technology/security/

Not all specified units of this processor support Enhanced Intel SpeedStep� Technology. See the Processor Spec Finder at http:/ /processorfinder.intel.com or contact your Intel representative for more information. Not all specified units of this processor support Thermal Monitor 2, Enhanced HALT State and Enhanced Intel SpeedStep� Technology. See the Processor Spec Finder at http://processorfinder.intel.com or contact your Intel representative for more information. Intel, Pentium, Intel Core, Intel SpeedStep, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright � 2007�2009, Intel Corporation. All Rights Reserved.

1 Introduction............................................................................................................ 11 1.1 Terminology..................................................................................................... 12 1.1.1 Processor Terminology Definitions............................................................ 12 1.2 References....................................................................................................... 14 Electrical Specifications........................................................................................... 15 2.1 Power and Ground Lands.................................................................................... 15 2.2 Decoupling Guidelines........................................................................................ 15 2.2.1 VCC Decoupling..................................................................................... 15 2.2.2 Vtt Decoupling....................................................................................... 15 2.2.3 FSB Decoupling...................................................................................... 16 2.3 Voltage Identification......................................................................................... 16 2.4 Reserved, Unused, and TESTHI Signals................................................................ 18 2.5 Power Segment Identifier (PSID)......................................................................... 18 2.6 Voltage and Current Specification........................................................................ 19 2.6.1 Absolute Maximum and Minimum Ratings.................................................. 2.6.2 DC Voltage and Current Specification........................................................ 20 2.6.3 VCC Overshoot...................................................................................... 24 2.6.4 Die Voltage Validation............................................................................. 24 2.7 Signaling Specifications...................................................................................... 25 2.7.1 FSB Signal Groups.................................................................................. 25 2.7.2 CMOS and Open Drain Signals................................................................. 27 2.7.3 Processor DC Specifications..................................................................... 27 2.7.3.1 Platform Environment Control Interface (PECI) DC Specifications..... 28 2.7.3.2 GTL+ Front Side Bus Specifications............................................. 29 2.8 Clock Specifications........................................................................................... 30 2.8.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking............................ 30 2.8.2 FSB Frequency Select Signals 31 2.8.3 Phase Lock Loop (PLL) and Filter.............................................................. 2.8.4 BCLK[1:0] Specifications......................................................................... 31 Package Mechanical Specifications.......................................................................... 35 3.1 Package Mechanical Drawing............................................................................... 35 3.2 Processor Component Keep-Out Zones................................................................. 39 3.3 Package Loading Specifications........................................................................... 39 3.4 Package Handling Guidelines............................................................................... 39 3.5 Package Insertion Specifications.......................................................................... 40 3.6 Processor Mass Specification............................................................................... 40 3.7 Processor Materials............................................................................................ 40 3.8 Processor Markings............................................................................................ 40 Land Listing and Signal Descriptions....................................................................... 43 4.1 Processor Land Assignments............................................................................... 43 4.2 Alphabetical Signals Reference............................................................................ 64 Thermal Specifications and Design Considerations.................................................. 75 5.1 Processor Thermal Specifications......................................................................... 75 5.1.1 Thermal Specifications............................................................................ 75 5.1.2 Thermal Metrology................................................................................. 81 5.2 Processor Thermal Features................................................................................ 81 5.2.1 Thermal Monitor..................................................................................... 81 5.2.2 Thermal Monitor 2.................................................................................. 82