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EP3SE110F1152I4N

Name: EP3SE110F1152I4N
Brand: INTEL
SKU: JT24-EP3SE110F1152I4N
Price: 0.0001 USD
Availability: InStock
Rating: 5 (1 reviews)

FPGA - Field Programmable Gate Array FPGA - Stratix III 4300 LABs 744 IOs

Manufacturer :	Intel Corp
Package/Case :	FBGA-1152
Product Categories :	FPGA - Field Programmable Gate Array
Datasheet:	EP3SE110F1152I4N Datasheet (PDF)
RoHs Status:	Rohs
In-stock:	65

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EP3SE110F1152I4N Product Details

The Stratix® III family provides one of the most architecturally advanced, high-performance, low-power FPGAs in the marketplace.

Stratix III FPGAs lower power consumption through Altera’s innovative Programmable Power Technology, which provides the ability to turn on the performance where needed and turn down the power consumption for blocks not in use. Selectable Core Voltage and the latest in silicon process optimizations are also employed to deliver the industry’s lowest power, high-performance FPGAs.

Specifically designed for ease of use and rapid system integration, the Stratix III FPGA family offers two variants optimized to meet different application needs: ■ The Stratix III L family provides balanced logic, memory, and multiplier ratios for mainstream applications. ■ The Stratix III E family is memory- and multiplier-rich for data-centric applications.

EP3SE110F1152I4N

Feature

Stratix III devices offer the following features:

■ 2,430 to 20,497 Kbits of enhanced TriMatrix memory consisting of three RAM block sizes to implement true dual-port memory and FIFO buffers

■ High-speed DSP blocks provide dedicated implementation of 9×9, 12×12, 18×18, and 36×36 multipliers (at up to 550 MHz), multiply-accumulate functions, and finite impulse response (FIR) filters

■ I/O:GND:PWR ratio of 8:1:1 along with on-die and on-package decoupling for robust signal integrity

■ Programmable Power Technology, which minimizes power while maximizing device performance

Technical Parameters

Series
Stratix III
Number of Logic Blocks
4300
Embedded Block RAM EBR
8 Mbit
Number of I/Os
744
Operating Supply Voltage
1.2 V to 3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
FBGA-1152
Distributed RAM
8.7 Mbit
Minimum Operating Temperature
- 40 C
Packaging
Tray

EP3SE110F1152I4N Datasheet

EP3SE110 Family PDF Datasheet

Download

EP3SE110F1152I4N Equivalent Parts

For the EP3SE110F1152I4N component, you may consider these replacement and alternative parts.

Models	Manufacturer	Package/Case	Description
EP3SE110F1152C4N	INTEL	FBGA-1152	FPGA - Field Programmable Gate Array FPGA - Stratix III 4300 LABs 744 IOs
EP3SE110F1152C2N	INTEL	FBGA-1152	FPGA - Field Programmable Gate Array FPGA - Stratix III 4300 LABs 744 IOs
EP3SE110F1152C3N	INTEL	FBGA-1152	FPGA - Field Programmable Gate Array FPGA - Stratix III 4300 LABs 744 IOs

EP3SE110F1152I4N Related Products

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2020-03-28

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Q: How does Jotrin guarantee that EP3SE110F1152I4N is the original manufacturer or agent of INTEL?: We have a professional business development department to strictly test and verify the qualifications of INTEL original manufacturers and agents. All INTEL suppliers must pass the qualification review before they can publish their EP3SE110F1152I4N devices; we pay more attention to the channels and quality of EP3SE110F1152I4N products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.
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Q: What is the process for returns or replacement of EP3SE110F1152I4N?: All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP3SE110F1152I4N we delivered, we will accept the replacement or return of the EP3SE110F1152I4N only when all of the below conditions are fulfilled:
(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.
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Intel Corporation is the world's largest semiconductor chip maker. Intel has been committed to the development of small, fast and energy-saving technologies to help mobile computing, desktop computin and data centers to achieve revolutionary advances in computing, and to promote fundamental changes...

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