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74AC16374DLG4 SSOP-48
TI
  • 74AC16374DLG4
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74AC16374DLG4

16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS,Flip Flops 16-Bit Edg-Trig D-Ty F-F W/3-State Otpt

Manufacturer :
Texas Instruments, Inc
Package/Case :
SSOP-48
Product Categories :
Flip Flops
Datasheet:
74AC16374DLG4 PDF
RoHs Status:
Rohs
In-stock:
1000

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74AC16374DLG4 Product Details

The 'AC16374 are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The 'AC16374 can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels set up at the data (D) inputs.

A buffered output-enableinput can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly.

does not affect the internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The 74AC16374DLG4 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54AC16374 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74AC16374DLG4 is characterized for operation from -40°C to 85°C.

Feature

  • Members of the Texas Instruments WidebusTM Family
  • 3-State True Outputs
  • Full Parallel Access for Loading
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Pin Configuration MinimizesHigh-Speed Switching Noise
  • EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic 300-mil Shrink Small-Outline(DL) Packages Using 25-mil Center-to-Center Pin Spacings and380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-milCenter-to-Center Pin Spacings

Technical Parameters

Number of Circuits 2 Maximum Operating Temperature + 85 C
Logic Family 74AC Mounting Style SMD/SMT
Logic Type D-Type Flip-Flop Package / Case SSOP-48
Polarity Non-Inverting Packaging Tube
Input Type Parallel Minimum Operating Temperature - 40 C
Output Type Single-Ended Number of Input Lines 8
Propagation Delay Time 15 ns Number of Output Lines 3
High Level Output Current - 24 mA Factory Pack Quantity 25
Low Level Output Current 24 mA Supply Voltage Min 3 V
Supply Voltage Max 5.5 V

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Texas Instruments, Inc

TI
Texas Instruments Incorporated designs and manufactures analog technologies, digital signal processing (DSP) and microcontroller (MCU) semiconductors. TI is a leader in semiconductor solutions for ana...
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