Products > Integrated Circuits (ICs) > Embedded Processors & Controllers > 66AK2H12BAAW24
  • 66AK2H12BAAW24

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Multicore DSP+ARM KeyStone II System-on-Chip (SoC)

  • Manufacturer :
  • TI
  • Package/Case :
  • BGA-1517
  • Product Categories :
  • Digital Signal Processors(DSPs)
  • RoHs Status:
  • Lead free / RoHS Compliant
  • Marking Code:
  • 66AK2H12AAW 1.2GHZ/1.4GHZ @2012 TI
  • In-stock:
  • 0


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66AK2H12BAAW24 Product Details

The 66AK2Hxx platform combines the quad ARM Cortex-A15 processor with up to eightTMS320C66x high-performance DSPs using the KeyStone II architecture. The 66AK2H14/12/06 deviceprovides up to 5.6 GHz of ARM and 9.6 GHz of DSP processing coupled with security, packetprocessing, and Ethernet switching at lower power than multichip solutions. The 66AK2H14/12/06device is optimal for embedded infrastructure applications like cloud computing, media processing,high-performance computing, transcoding, security, gaming, analytics, and virtual desktop.

The C66x core combines fixed-point and floating-point computational capability in theprocessor without sacrificing speed, size, or power consumption. The raw computational performanceis 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). The C66x is also 100%backward compatible with software for C64x+ devices. The C66x core incorporates 90 new instructionstargeted for floating point (FPi) and vector math oriented (VPi) processing.

The 66AK2H14/12/06 device has a complete set of development tools that includes: a Ccompiler, an assembly optimizer to simplify programming and scheduling, and aWindows debugger interface forvisibility into source code execution.



  • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With
    • 1.0 GHz or 1.2 GHz C66x Fixed- and Floating-Point DSP Core
      • 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
      • 19.2 GFlops/Core for Floating Point @ 1.2 GHz
    • Memory
      • 32-KB L1P Per CorePac
      • 32-KB L1D Per CorePac
      • 1024-KB Local L2 Per CorePac
  • ARM CorePac
    • Four ARM Cortex-A15 MPCore Processors at up to 1.4 GHz
    • 4MB of L2 Cache Memory Shared by Four ARM Cores
    • Full Implementation of ARMv7-A Architecture Instruction Set
    • 32-KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE) Master Port, Connected to MSMC for Low-Latency Access to Shared MSMC SRAM
  • Multicore Shared Memory Controller (MSMC)
    • 6MB of MSM SRAM Memory Shared by Eight DSP CorePacs and One ARM CorePac
    • Memory Protection Unit (MPU) for Both MSM SRAM and DDR3_EMIF
  • Multicore Navigator
    • 16k Multipurpose Hardware Queues With Queue Manager
    • Packet-Based DMA for Zero-Overhead Transfers
  • Network Coprocessor
    • Packet Accelerator Enables Support for
      • Transport Plane IPsec, GTP-U, SCTP, PDCP
      • L2 User Plane PDCP (RoHC, Air Ciphering)
      • 1-Gbps Wire Speed Throughput at 1.5 MPackets Per Second
    • Security Accelerator Engine Enables Support for
      • IPSec, SRTP, 3GPP, and WiMAX Air Interface, and SSL/TLS Security
      • ECB, CBC, CTR, F8, A5/3, CCM, GCM, HMAC, CMAC, GMAC, AES, DES, 3DES, Kasumi, SNOW 3G, SHA-1, SHA-2 (256-Bit Hash), MD5
      • Up to 2.4 Gbps IPSec and 2.4 Gbps Air Ciphering
    • Ethernet Subsystem
      • Five-Port Switch (Four SGMII Ports)
  • Peripherals
    • Four Lanes of SRIO 2.1
      • Supports up to 5 GBaud
      • Supports Direct I/O, Message Passing
    • Two Lanes PCIe Gen2
      • Supports up to 5 GBaud
    • Two HyperLinks
      • Supports Connections to Other KeyStone Architecture Devices Providing Resource Scalability
      • Supports up to 50 GBaud
    • 10-Gigabit Ethernet (10-GbE) Switch Subsystem (66AK2H14 Only)
      • Two XFI Ports
      • IEEE 1588 Support
    • Five Enhanced Direct Memory Access (EDMA) Modules
    • Two 72-Bit DDR3/DDR3L Interfaces With Speeds up to 1600 MHz
    • EMIF16 Interface
    • USB 3.0
    • Two UART Interfaces
    • Three I2C Interfaces
    • 32 GPIO Pins
    • Three SPI Interfaces
    • Semaphore Module
    • 64-Bit Timers
      • Twenty 64-Bit Timers for 66AK2H14 and 66AK2H12
      • Fourteen 64-Bit Timers for 66AK2H06
    • Five On-Chip PLLs
  • Commercial Case Temperature:
    • 0oC to 85oC
  • Extended Case Temperature:
    • –40oC to 100oC

Technical Parameters

  • Type
  • DSP+ARM?
  • Interface
  • EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Clock Rate
  • 1.2GHz DSP, 1.4GHz ARM?
  • Non Volatile Memory
  • ROM (384 kB)
  • On Chip RAM
  • 12.75MB
  • Voltage I/O
  • 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • Voltage Core
  • Variable
  • Operating Temperature
  • 0??C ~ 85??C (TC)
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 1517-BBGA, FCBGA
  • Supplier Device Package
  • 1517-FCBGA (40x40)

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