ZIP-6
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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0.5a 250vac 3pins the door switch is mainly used for the illumination in the home electrical appliances,such as refrigerators,freezers and congealers and for the fan control,at the same time may be also applicable for the power control in the m
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 340
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50MHz, 800V/μs Op Amp; Package: PDIP; No of Pins: 8; Temperature Range: 0°C to +70°C
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 188
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Power Amplifier 1880-1920 MHz 35 dB min. Gain @ 1900MHz
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 234
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Pressure Sensor 0.2V to 4.7V 0kPa to 50kPa Differential 6-Pin Case 867C-05 Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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HYBRID IC FOR DRIVING HIGH BETA TRANSISTOR MODULES
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 90
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Fiber Optic Connectors VERSATILE LINK DUPLE X CONN RoHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9800
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Fiber Optic Transmitters, Receivers, Transceivers Versatile Link Horiz 10MBd Rx RoHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Fiber Optic Transmitters, Receivers, Transceivers V-LINK HORIZ 1MBd RC VR RoHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3600
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Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0534-4 24; No. of Positions: 6; Connector Type: Board mounting; Contact Gender: Male; Contact Spacing (mm): 2; Terminal Pitch (mm): 2; PCB Mount Type: Thr,Headers & Wire Housings 2MM R/A PCB HEADER 6P DR THRU-HOLE TIN
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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Q:What defines the physical structure of ZIP-6?
A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity.
- Central thermal pad: 80% coverage for efficient heat dissipation.
- 6-pin layout: Dual-row staggered arrangement.
- Ultra-thin profile: 0.8 mm thickness for space-constrained designs. -
Q:Why choose ZIP-6 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than SOP-8 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 25%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant ceramic substrate (MSL-3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 3.0 × 3.0 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is ZIP-6 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TI TPS62130).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., Nordic nRF52840).
- Sensor Interfaces: MEMS accelerometers (e.g., ST LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 μm).
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).



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