ZIP-3
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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EMI/RFI Suppressors & Ferrites 10KpF 35MHZ +80-20% SIP Filter
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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DUAL BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2450
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TECHNICAL SPECIFICATIONS OF SINGLE-PHASE SILICON BRIDGE RECTIFIER
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3651
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2 AMP POSITIVE STEP-DOWN INTEGRATED SWITCHING REGULATOR,Switching Converters, Regulators & Controllers 5Vout 2A Wide-Inpt Pos Step-Down ISR
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1 + 10 + 25 + 50 + >=100 -
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TRANSISTOR | BJT | PNP | 60V V(BR)CEO | 1A I(C) | TO-202AC
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500
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Q:What defines the physical structure of ZIP-3?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 24-pin layout with dual-row staggered arrangement: Optimizes space efficiency.
- 1.2 mm ultra-thin profile: Ideal for compact designs. -
Q:Why choose ZIP-3 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOP-8 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 5.0 × 4.0 mm
- Height: 1.2 mm
- Pin Pitch: 0.65 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is ZIP-3 typically applied?
A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS54302).
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (e.g., CC2652).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias (4×4 array) under central pad.
- Solder Paste: Type 4 solder recommended for fine-pitch pins.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.



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