VPE: 500/BULK
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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Suppression Film Capacitors 440volts 820pF 20% LS 15mm
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 579800
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Suppression Film Capacitors 440volts 680pF 20% LS 15mm
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 26017
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Suppression Film Capacitors 440volts 560pF 20% LS 15mm
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 585000
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Aluminum Capacitors Low Leakage Current Radial Style
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500
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T-1 3/4(5mm) SOLID STATE LAMPS,Standard LED - Through Hole RED DIFFUSED
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 103024
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LED Lamp; Bulb Size:T-1; LED Color:Yellow; Luminous Intensity:35ucd; Viewing Angle:45 ; Forward Current:20mA; Forward Voltage:1.9V; Operating Temperature Range:-25 C to +80 C; Color:Yellow; Leaded Process Compatible:Yes RoHS Compliant: Yes,Standard LED - Through Hole T-1 LED RED CLR
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 158000
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Q:What defines the physical structure of VPE: 500/BULK?
A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB connectivity.
- Central thermal pad (80% coverage): Optimizes heat dissipation.
- 24-pin layout with perimeter array: Balanced signal distribution.
- 0.8 mm ultra-thin profile: Saves vertical space in compact designs. -
Q:Why choose VPE: 500/BULK over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOP-24 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15°C.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 4.0 × 4.0 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is VPE: 500/BULK typically applied?
A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (e.g., CC2650).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., LIS3DH). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under pad (0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch reliability.
- Reflow Profile: Peak temp ≤ 245°C (ramp rate: 2°C/sec).
- Inspection: X-ray (AXI) mandatory for void detection.



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