ALL CATEGORIESTUMT-6
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Trans MOSFET N-CH Si 30V 1.5A 6-Pin TUMT T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 26
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Dual N/P-Channel MOSFET, 1 (P Channel) A, 1.5 (N Channel) A, 20 (P Channel) V, 30 (N Channel) V US6M2, 6-Pin
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15000
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Dual N/P-Channel MOSFET, ±1 (PChannel) A, ±1.4 (NChannel) A, 20 (PChannel) V, 30 (NChannel) V US6M1, 6-Pin TUMT
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 51000
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1.8V Drive Nch+Nch MOSFET; Package: TUMT6; Constitution materials list: Packing style: Taping; Package quantity: 3000;,MOSFET Med Pwr, Sw MOSFET N Chan, 20V, 1.5A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 48000
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MOSFET 2N-CH 30V 1.4A TUMT6,MOSFET 2N-CH 30V 1.4A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 236000
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Dual N-Channel MOSFET, 1.5 A, 30 V US6K1, 6-Pin SOT-363 ROHM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 51000
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MOSFET Med Pwr, Sw MOSFET P Chan, -12V, -3.5A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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1.5V Drive Nch MOSFET; Package: TUMT6; Constitution materials list: Packing style: taping; Package quantity: 3000;,MOSFET Med Pwr, Sw MOSFET N Chan, 20V, 3.5A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 36000
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MOSFET N-CH 30V 3.5A TUMT6,MOSFET N-CH 30V 3.5A TUMT6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1635
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MOSFET P-CH 30V 2A TUMT6,MOSFET Med Pwr, Sw MOSFET P Chan, -30V, -2A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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Dual P-Channel MOSFET, 3.5 A, 12 V, 6-Pin SOT-363T ROHM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 70000
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Q:What defines the physical structure of TUMT-6?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Optimizes heat dissipation.
- 24-pin layout with dual-row perimeter arrangement: Balances pin density and routing flexibility.
- 0.8 mm ultra-thin profile: Ideal for space-constrained designs. -
Q:Why choose TUMT-6 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than QFN-24.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 25%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 4.0 × 4.0 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is TUMT-6 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62130).
- RF Modules: 5G PA modules (e.g., SKY66421).
- Sensor Interfaces: MEMS sensors (e.g., BME280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias array under central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch reliability.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).