TSSOP-5
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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XNOR Gate, 74LV1T87 Family, 2 Inputs, 1.6V to 5.5V Supply, TSSOP-5
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 18000
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Inverter, Schmitt Trigger, 74LVC1G14, 1 Input, 50 mA, 1.65 V to 5.5 V, TSSOP-5
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1300
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Operational Amplifiers - Op Amps SINGLE OP AMP LOGIC
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Analog Switch ICs Analog SW Single SPST 4.3V 5-Pin
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Analog Switch Single SPST Automotive 6-Pin XSON T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Analog Switch Single SPST Automotive 5-Pin SOT-353 T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4048
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Analog Switch ICs Analog SW Single SPST 3.6V 5-Pin
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15
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Analogue Comparator, RRIO, Low Voltage, 1 Comparator, 1.3V to 5.5V, TSSOP, 5 Pins
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 47840
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Analogue Comparator, Rail to Rail, Low Voltage, 1 Comparator, 0.8 µs, 1.3V to 5.5V, TSSOP, 5 Pins
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3073
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Buffers & Line Drivers Single Schmt Trigger 5.5 V TTL
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10940
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Inverting Schmitt trigger - Description: PicoGate Inverting Schmitt-Trigger; TTL Enabled ; Logic switching levels: TTL ; Number of pins: 5 ; Output drive capability: +/- 2.0 mA ; Power dissipation considerations: Low Power ; Propagation delay: 15 ns;,Inverters INVERTING SCHMT TRIG
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 50000
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Bus buffer/line driver; 3-state - Description: PicoGate Buffer/Line Driver with Active HIGH Output Enable; TTL Enabled (3-State) ; Logic switching levels: TTL ; Number of pins: 5 ; Output drive capability: +/- 2.0 mA ; Power dissipation consideration,Buffers & Line Drivers BUS BFR/LINE DRV;3-S
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 24000
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Inverter - Description: PicoGate Inverter; TTL Enabled ; Logic switching levels: TTL ; Number of pins: 5 ; Output drive capability: +/- 2.0 mA ; Power dissipation considerations: Low Power ; Propagation delay: 8 ns; Voltage: 4.5-5.5; Package: SOT353-,Inverters INVERTER
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 39000
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Bilateral switch - Description: PicoGate Bilateral Switch ; Logic switching levels: CMOS ; Number of pins: 5 ; On resistance: 21 Ohms; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 12@5V ns; Voltage: 2.0-9.0,Multiplexer Switch ICs BILATERAL SWITCH PICOGATE
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20000
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Q:What defines the physical structure of TSSOP-5?
A:Key features include:
- Compact leadframe design: Leadless bottom-mounted pads for space efficiency.
- Thermal pad: Optional central pad (e.g., 1.2 mm² coverage) for improved heat dissipation.
- Pin layout: 5-pin configuration with dual-row gull-wing leads.
- Low profile: Ultra-thin body (e.g., 1.0 mm height) for high-density PCB designs. -
Q:Why choose TSSOP-5 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than SOIC-8.
- Thermal Performance: Direct PCB heat sinking via exposed pad (if present).
- Electrical Benefits: Low-inductance leads for high-frequency stability.
- Reliability: Moisture-resistant mold compound (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.0 × 2.1 mm (varies by manufacturer).
- Height: 1.0 mm (nominal).
- Pin Pitch: 0.65 mm (standard).
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is TSSOP-5 typically applied?
A:Dominant use cases:
- Power Management: Voltage regulators (e.g., TI TPS7A05).
- Signal Conditioning: Op-amps (e.g., AD8605).
- Portable Electronics: Sensor interfaces (e.g., I²C accelerometers). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias under exposed pad (if applicable).
- Solder Paste: Type 4 (fine-pitch) recommended for 0.65 mm pitch.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: AXI (Automated X-ray) for pad solder joint verification.



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