TSSOP-38
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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ARM MCU, Kinetis E Family KE0x Series Microcontrollers, ARM Cortex-M0+, 32bit, 48 MHz, 128 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15
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Microcontroller Application Specific, EFR32 Family EFR32MG Series, 32bit, 32KB RAM, 2.4GHz, QFN-48
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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DC-DC Cntrlr Single-OUT Step Down/Step Up 735kHz Automotive 38Pin TSSOP EP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2790
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18-Bit SAR ADC With 8 Channels, 500kSPS, and Bipolar Inputs Off 5V Supply
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1 + 10 + 25 + 50 + >=100 -
1
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18-Bit SAR ADC With 4 Channels, 500kSPS, and Bipolar Inputs Off 5V Supply
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1 + 10 + 25 + 50 + >=100 -
1
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16-Bit SAR ADC With 8 Channels, 500kSPS, and Bipolar Inputs off +5V supply
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1 + 10 + 25 + 50 + >=100 -
1
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16-Bit SAR ADC With 4 Channels, 500kSPS, and Bipolar Inputs Off 5V Supply
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1 + 10 + 25 + 50 + >=100 -
1
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14-Bit SAR ADC With 4 Channels, 500kSPS, and Bipolar Inputs Off 5V Supply
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1 + 10 + 25 + 50 + >=100 -
1
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12-Bit SAR ADC With 8 Channels, 500kSPS, and Bipolar Inputs Off 5V Supply
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1 + 10 + 25 + 50 + >=100 -
1
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18-Bit SAR ADC With 8 Channels, 500kSPS, and Bipolar Inputs Off 5V Supply
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1 + 10 + 25 + 50 + >=100 -
1
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18-Bit SAR ADC With 4 Channels, 500kSPS, and Bipolar Inputs Off 5V Supply
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1 + 10 + 25 + 50 + >=100 -
1
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Analogue to Digital Converter, 16 bit, 500 kSPS, Single Ended, SPI, Single, 4.75 V
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1 + 10 + 25 + 50 + >=100 -
1
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16-Bit SAR ADC With 8 Channels, 500kSPS, and Bipolar Inputs off +5V supply
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1 + 10 + 25 + 50 + >=100 -
1
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SAR ADC With 16 Bits, 4 Channels, 500kSPS, and Bipolar Inputs Off 5V supply
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1 + 10 + 25 + 50 + >=100 -
1
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SAR ADC With 16 Bits, 4 Channels, 500kSPS, and Bipolar Inputs Off 5V supply
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1 + 10 + 25 + 50 + >=100 -
1
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14-Bit SAR ADC With 4 Channels, 500kSPS, and Bipolar Inputs Off 5V Supply
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1 + 10 + 25 + 50 + >=100 -
1
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12-Bit SAR ADC With 8 Channels, 500kSPS, and Bipolar Inputs Off 5V Supply
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1 + 10 + 25 + 50 + >=100 -
1
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12-Bit SAR ADC With 4-Channels, 500kSPS, and Bipolar Inputs Off 5V Supply
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1 + 10 + 25 + 50 + >=100 -
1
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Automotive 8-Bit, 1MSPS, 16-Channel Single-Ended Micropower, Serial Interface ADC
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1 + 10 + 25 + 50 + >=100 -
1
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12-Bit SAR ADC With 4-Channels, 500kSPS, and Bipolar Inputs Off 5V Supply
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1 + 10 + 25 + 50 + >=100 -
1
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Automotive 10-Bit, 1MSPS, 16-Channel Single-Ended Micropower, Serial Interface ADC
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1 + 10 + 25 + 50 + >=100 -
1
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Automotive 10-Bit, 1MSPS, 12-Channel Single-Ended Micropower, Serial Interface ADC
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1 + 10 + 25 + 50 + >=100 -
1
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Automotive 12-Bit, 1MSPS, 16-Channel Single-Ended Micropower, Serial Interface ADC
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1 + 10 + 25 + 50 + >=100 -
1
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Automotive 12-Bit, 1MSPS, 12-Channel Single-Ended Micropower, Serial Interface ADC
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1 + 10 + 25 + 50 + >=100 -
1
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MSP430FR5949 16 MHz Ultra-Low-Power Microcontroller featuring 64 KB FRAM, 2 KB SRAM, 33 IO
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1 + 10 + 25 + 50 + >=100 -
1
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Q:What defines the physical structure of TSSOP-38?
A:Key features include:
- Leadframe design: Exposed thermal pad for enhanced heat dissipation.
- Compact layout: 38-pin configuration with dual-row gull-wing leads.
- Thin profile: 1.0 mm maximum height for space-constrained applications.
- Standardized footprint: Compatible with automated PCB assembly. -
Q:Why choose TSSOP-38 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than SOIC-38.
- Thermal Performance: Exposed die pad (3.5×3.5 mm coverage) for direct PCB heat sinking.
- Electrical Benefits: Low-inductance (<1 nH) leadframe for high-speed signals.
- Reliability: Moisture-resistant (MSL3-rated) mold compound. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 9.7×4.4 mm (nominal).
- Height: 1.0 mm (max).
- Pin Pitch: 0.5 mm.
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is TSSOP-38 typically applied?
A:Dominant use cases:
- Power Management: DC-DC converters (e.g., TI TPS5430).
- Communication ICs: Serial transceivers (e.g., MAX3232).
- Embedded Systems: Microcontroller interfaces (e.g., STM32 GPIO expanders). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias (≥4) under exposed pad; 0.1 mm solder mask clearance.
- Solder Paste: Type 4 (20–38 μm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: AXI (Automated X-ray) required for pad solder joint verification.



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