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TSSOP-38

The TSSOP-38 (Thin Shrink Small Outline Package, 38 leads) is a surface-mount package designed for high-density circuits. Featuring an ultra-thin profile, leadless design, and an exposed thermal pad, it delivers significant space savings and superior heat dissipation. Typical dimensions are 9.7×4.4 mm with a 0.5 mm pin pitch and a height of approximately 1.0 mm, making it ideal for portable electronics, industrial controllers, and communication modules. Its bottom-exposed thermal pad enables direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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  • MKE04Z128VLK4
  • MKE04Z128VLK4 Hot Sale

    Manufacturer: NXP

    Package/Case: TSSOP-38

  • ARM MCU, Kinetis E Family KE0x Series Microcontrollers, ARM Cortex-M0+, 32bit, 48 MHz, 128 KB
  • 1 +
    10 +
    25 +
    50 +
    >=100
  • Minimum : 1 In-stock : 15
  • ADS8684AIDBT
  • ADS8684AIDBT Hot Sale

    Manufacturer: TI

    Package/Case: TSSOP-38

  • Analog to Digital Converters - ADC 16-bit SAR ADC, 4 channels, 500 kSPS, and bipolar inputs off +5V supply 38-TSSOP -40 to 125
  • 1 +
    10 +
    25 +
    50 +
    >=100
  • 1