TSSOP28

Q:What defines the physical structure of TSSOP28?

A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (3×3 mm coverage): Enhances heat dissipation.
- 28-pin layout with dual-row gull-wing leads: Optimizes space efficiency.
- 1.0 mm ultra-thin profile: Reduces vertical footprint.

Q:Why choose TSSOP28 over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller than SOIC-28.
- Thermal Performance: Direct PCB heat path via thermal pad.
- Electrical Benefits: Low-inductance design for high-frequency signals.
- Reliability: Moisture-resistant substrate (MSL3 rated).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 9.7×4.4 mm
- Height: 1.0 mm
- Pin Pitch: 0.65 mm
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C.

Q:Where is TSSOP28 typically applied?

A:Dominant use cases:
- Power Management: Buck converters (e.g., TPS5430).
- Communication ICs: USB controllers (e.g., FTDI FT232).
- Sensor Interfaces: ADC/DAC chips (e.g., MCP3208).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Thermal vias under pad (≥4 vias, 0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine pitch.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad alignment verification.