TSOP-54
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- Description
- Unite Price
- Quantity
- Operation
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DRAM Chip SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3300
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DRAM SDRAM 256M 16M X 16 54 TSOP I TEMP , LEADED TAPE AND REEL
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 700
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DRAM Chip SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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DRAM Chip SDRAM 128Mbit 8Mx16 3.3V 54-Pin TSOP-II
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 113
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256M, 3.3V, SDRAM, 16Mx16, 143MHz, 54 pin TSOP II RoHS, IT
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6707
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Q:What defines the physical structure of TSOP-54?
A:Key features include:
- 54-pin layout with dual-row symmetrical arrangement
- Leadless bottom-mounted pads for compact PCB footprint
- Ultra-thin profile: 1.0 mm nominal thickness
- Exposed thermal pad (4.5×4.5 mm coverage) for enhanced heat dissipation -
Q:Why choose TSOP-54 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than comparable SOIC packages.
- Thermal Performance: Direct PCB heat path via central thermal pad.
- Electrical Benefits: Low-inductance leads for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 10.0×10.0 mm
- Height: 1.0 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with matte Sn plating
- Temp Range: -40°C to +125°C -
Q:Where is TSOP-54 typically applied?
A:Dominant use cases:
- Memory Modules: e.g., NAND flash (e.g., Micron MT29F series)
- Power Management: e.g., DC-DC converters (e.g., TI TPS54360)
- Consumer Electronics: e.g., Display drivers in smart devices -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias (≥4) under the central pad for heat dissipation.
- Solder Paste: Type 4 solder paste (particle size 20–38 μm).
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for solder joint verification.



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