Home > Product Categories > TSOP-54

TSOP-54

The TSOP-54 (Thin Small Outline Package) is a surface-mount package designed for high-density integrated circuits. Featuring an ultra-thin profile, high pin density, and gull-wing leads, it delivers compact size and reduced signal interference. Typical dimensions are 22.22 mm × 10.16 mm × 1.2 mm with a 0.8 mm pin pitch, making it ideal for memory devices in portable electronics. Its gull-wing lead design enables direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
  • Picture & Models
  • Description
  • Unite Price
  • Quantity
  • Operation
  • W9864G6JH-7
  • W9864G6JH-7 Hot Sale

    Manufacturer: WINBOND

    Package/Case: TSOP-54

  • Self Refresh Current: Standard and Low Power, Sequential and Interleave Burst
  • 1 +
    10 +
    25 +
    50 +
    >=100
  • Minimum : 1 In-stock : 36