ALL CATEGORIESTSOP 48
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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32G bit Nand Flash TSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2389
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32G bit Nand Flash
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2398
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4G bit Nand Flash
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1 + 10 + 25 + 50 + >=100 -
1
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SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1063
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 110
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32M NOR Flash Memory
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4579
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15A 45V Schottky Rectifier; Package: TO-220 3 LEAD STANDARD; No of Pins: 3; Container: Rail; Qty per Container: 50
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8500
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16M-BIT [2Mx8/1Mx16] CMOS SINGLE VOLTAGE 3V ONLY BOOT SECTOR HIGH SPEED eLiteFlashTM MEMORY
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 950
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1208
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2500
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Memory chips
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15069
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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4M(X8/X16)|3.0V|55|NOR FLASH - 4M
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1 + 10 + 25 + 50 + >=100 -
1
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Memory
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 50
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Memory
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1800
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3200
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Quadruple 2-Input Positive-NAND Gate 14-VQFN -40 to 125
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1358
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4 Megabit (524,288 x 8-Bit/262,144 x 16-Bit) CMOS 5.0 Volt-only, Sector Erase Flash Memory
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2192
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EPROM Serial EEPROM
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1 + 10 + 25 + 50 + >=100 -
1
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Q:What defines the physical structure of TSOP-48?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad: Optional for enhanced heat dissipation (varies by variant).
- 48-pin layout: Dual-row gull-wing leads with 0.5 mm pitch.
- Ultra-thin profile: Typical height of 1.0 mm for space-constrained designs. -
Q:Why choose TSOP-48 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than SOIC-48 equivalents.
- Thermal Performance: Exposed die pad option for direct PCB heat sinking.
- Electrical Benefits: Low-inductance lead frame for high-speed signals.
- Reliability: Moisture-resistant (MSL3) epoxy molding compound. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 12.0 × 18.4 mm (varies by manufacturer).
- Height: 1.0 mm (nominal).
- Pin Pitch: 0.5 mm.
- Material: Copper-alloy leads with matte tin plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is TSOP-48 typically applied?
A:Dominant use cases:
- Memory Modules: NAND flash (e.g., Micron MT29F series).
- Networking ICs: Ethernet PHY chips (e.g., Realtek RTL8211).
- Embedded Systems: Microcontroller interfaces (e.g., STM32F4 variants). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias under exposed pad (if present).
- Solder Paste: Type 3 or 4 recommended for fine-pitch reflow.
- Reflow Profile: Peak temperature ≤ 250°C (SnAgCu alloys).
- Inspection: AXI (Automated X-ray) for lead coplanarity verification.