ALL CATEGORIESTSOP44
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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FRAM 4Mbit Parallel Interface 3.3V 44-Pin TSOP Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 44
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 30
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 65
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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Memory
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1 + 10 + 25 + 50 + >=100 -
1
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Memory
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1 + 10 + 25 + 50 + >=100 -
1
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IC SRAM 8M PARALLEL 44TSOP II
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Memory
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1 + 10 + 25 + 50 + >=100 -
1
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Memory
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1 + 10 + 25 + 50 + >=100 -
1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3750
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
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SRAM 256Kx16 TSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1640
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EDO 256Kx16
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1 + 10 + 25 + 50 + >=100 -
1
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64M bit Nand Flash
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1 + 10 + 25 + 50 + >=100 -
1
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8 Mbit (512K x16) 3.0V Asynchronous SRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 105
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 103
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Virtex-II 1.5V Field-Programmable Gate Arrays
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 714
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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64K X 16 High Speed CMOS Static RAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4145
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128K X 16 High Speed CMOS Static RAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3200
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12530
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8900
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6542
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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64K x 16 HIGH SPEED STATIC RAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16800
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HIGH PERFORMANCE 3.3 VOLT 256K X 16 EDO PAGE MODE CMOS DYNAMIC RAM OPTIONAL SELF REFRESH
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8900
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HIGH PERFORMANCE 3.3 VOLT 256K X 16 EDO PAGE MODE CMOS DYNAMIC RAM OPTIONAL SELF REFRESH
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6328
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HIGH PERFORMANCE 3.3 VOLT 256K X 16 EDO PAGE MODE CMOS DYNAMIC RAM OPTIONAL SELF REFRESH
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8900
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HIGH PERFORMANCE 256K X 16 EDO PAGE MODE CMOS DYNAMIC RAM OPTIONAL SELF REFRESH
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8872
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HIGH PERFORMANCE 3.3 VOLT 256K X 16 EDO PAGE MODE CMOS DYNAMIC RAM OPTIONAL SELF REFRESH
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8900
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HIGH PERFORMANCE 3.3 VOLT 256K X 16 EDO PAGE MODE CMOS DYNAMIC RAM OPTIONAL SELF REFRESH
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6328
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8900
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8900
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8900
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8900
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8900
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8900
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4M-BIT CMOS FAST SRAM 256K-WORD BY 16-BIT
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 90
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4M-BIT CMOS FAST SRAM 256K-WORD BY 16-BIT
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 460
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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4M-BIT CMOS FAST SRAM 256K-WORD BY 16-BIT EXTENDED TEMPERATURE OPERATION
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1 + 10 + 25 + 50 + >=100 -
1
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x8 SRAM
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1 + 10 + 25 + 50 + >=100 -
1
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x16 SRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12000
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x16 SRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12000
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x16 SRAM
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1 + 10 + 25 + 50 + >=100 -
1
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Q:What defines the physical structure of TSOP44?
A:Key features include:
- Thin profile: 1.0 mm ultra-thin body height.
- Pin layout: 44-pin configuration with dual-row gull-wing leads.
- Compact footprint: Symmetrical lead spacing for dense PCB layouts.
- Material: Plastic-molded body with copper-alloy leads for durability. -
Q:Why choose TSOP44 over alternatives?
A:Critical advantages:
- Space-saving: 30% smaller than SOP44 packages.
- Thermal Performance: Efficient heat dissipation through exposed die pad (80% coverage).
- Electrical Benefits: Low-inductance leads for high-speed signal integrity.
- Reliability: Moisture-resistant (MSL3) and RoHS-compliant. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 10.16 × 18.41 mm.
- Height: 1.0 mm.
- Pin Pitch: 0.8 mm.
- Material: Copper-alloy leads with matte tin plating.
- Temp Range: -40°C to +125°C. -
Q:Where is TSOP44 typically applied?
A:Dominant use cases:
- Memory Devices: NAND flash (e.g., Micron MT29F series).
- Consumer Electronics: Smart TVs, set-top boxes.
- Industrial Systems: Embedded controllers (e.g., STM32 MCUs). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias under the central pad for heat dissipation.
- Solder Paste: Type 3 or 4 recommended for fine-pitch soldering.
- Reflow Profile: Peak temperature ≤ 250°C (Pb-free process).
- Inspection: Optical or X-ray (AXI) to verify lead coplanarity.