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Voltage References LT1031 - Precision 10 Volt Reference
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8012
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6
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National Semiconductor(TI)
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Minimum : 1 In-stock : 5
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 40
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1366
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1678
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 60
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Other Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 123
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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IC Chips
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Minimum : 1 In-stock : 208
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3-Terminal 1A Positive Voltage Regulator
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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Standard Regulator Pos 1.2V to 33V 3A 3-Pin(2+Tab) TO-3 Tray
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1 + 10 + 25 + 50 + >=100 -
1
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Diode Switching 500V 30A 3Pin(2+Tab) TO-3
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 908
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TO-3 15V 50W
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 963
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TO-3 20V 50W
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 823
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TO-3 8.2V 50W
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 550
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 368
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Standard Regulator 1.2V to 37V 0.1A 8-Pin SOIC N Rail
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7500
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 311
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5
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Integrated Circuits (ICs)
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1
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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Trans IGBT Chip N-CH 600V 80A 375000mW 3-Pin(3+Tab) TO-3P Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10
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NPN SILICON TRANSISTOR
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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N/A
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In-stock : 0
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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THYRISTOR MODULE
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Minimum : 1 In-stock : 20
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Series Voltage Regulators
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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5-Amp Adjustable Regulators
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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3-Terminal 1A Negative Voltage Regulator; Package: TO-220; No of Pins: 3; Container: Rail
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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Transistors
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In-stock : 1
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Transistors
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Minimum : 1 In-stock : 100
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Standard Regulator Neg -15V 1.4A 3-Pin TO-39
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 533
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 70
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INSULATING KIT, MICA, TO-3
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 555
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 50
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Stratix II FPGA 60K FBGA-672
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1 + 10 + 25 + 50 + >=100 -
1
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Stratix II FPGA 130K FBGA-780
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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Cyclone II FPGA 50K UFBGA-484
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1 + 10 + 25 + 50 + >=100 -
1
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Stratix II GX FPGA 130K FPGA-40
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1 + 10 + 25 + 50 + >=100 -
1
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CYCLONE III FPGA 5K 144-EQFP
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1 + 10 + 25 + 50 + >=100 -
1
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CYCLONE III FPGA 119K 780FBGA
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1 + 10 + 25 + 50 + >=100 -
1
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Stratix II FPGA 90K FBGA-780
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6500
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Q:What defines the physical structure of TO-3?
A:Key features include:
- Metal can packaging: Robust hermetically sealed metal casing for durability.
- Central mounting hole: Facilitates secure heatsink attachment (e.g., M3/M4 screw compatibility).
- 2-pin layout: High-current leads (typically 10–20A rated) with radial or vertical orientation.
- Large thermal base: 20–25 mm diameter baseplate for efficient heat dissipation. -
Q:Why choose TO-3 over alternatives?
A:Critical advantages:
- High power handling: Supports up to 100W+ dissipation (vs. TO-220’s ~50W).
- Thermal Performance: Direct metal-to-heatsink contact for <1.5°C/W thermal resistance.
- Electrical Benefits: Low-inductance leads for stable high-current applications.
- Reliability: Hermetic sealing ensures moisture/chemical resistance (MIL-STD compliant). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 22.5 mm diameter (round can).
- Height: 10.5 mm (excluding leads).
- Lead Spacing: 5.45 mm (standard pitch).
- Material: Aluminum/stainless steel casing, copper alloy leads.
- Temp Range: -65°C to +200°C (military-grade options available). -
Q:Where is TO-3 typically applied?
A:Dominant use cases:
- Power electronics: Linear regulators (e.g., LM317K), motor drivers.
- High-voltage devices: Audio amplifiers (e.g., 2N3055 transistors).
- Aerospace/defense: Ruggedized systems requiring hermetic sealing. -
Q:What are critical assembly guidelines?
A:Key recommendations:
- Heatsink Mounting: Use thermal grease + 5–10 N·m torque on mounting screw.
- PCB Design: Reinforced holes for lead strain relief; avoid thin traces.
- Handling: Avoid bending leads repeatedly (risk of metal fatigue).
- Inspection: Visual check for can integrity and lead oxidation pre-soldering.