ALL CATEGORIESTO-264-3, TO-264
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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Trans IGBT Chip N-CH 3000V 130A 625000mW 3Pin(3+Tab) TO-264
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 822
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GenX3 XPT IGBT 900V 140A Through Hole High-Speed IGBT - TO-264
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 120
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Trans IGBT Chip N-CH 600V 200A 695000mW Automotive 3Pin TO-264
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 837
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IGBT Transistors XPT 600V IGBT GenX3
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9500
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IGBT Transistors GenX3 XPT 600V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9500
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IGBT Transistors 75Amps 600V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Trans IGBT Chip N-CH 600V 178A 540000mW 3Pin(3+Tab) TO-264
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9500
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IGBT Transistors 75Amps 600V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Trans IGBT Chip N-CH 1700V 110A 1040000mW 3Pin(3+Tab) TO-264
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Trans IGBT Chip N-CH 1700V 200A 1040000mW 3Pin(3+Tab) TO-264
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Q:What defines the physical structure of TO-264-3/TO-264?
A:Key features include:
- Robust metal tab: Integrated for direct mounting to heatsinks.
- Central thermal pad: Covers ~80% of the base area for efficient heat dissipation.
- 3-pin (TO-264-3) or multi-pin (TO-264) layout: Horizontal lead arrangement for easy PCB integration.
- Compact profile: Typical height of 4.8 mm (TO-264-3) and 5.0 mm (TO-264). -
Q:Why choose TO-264-3/TO-264 over alternatives?
A:Critical advantages:
- Thermal Performance: Direct metal-to-heatsink attachment lowers thermal resistance by 30% vs. plastic packages.
- High Current Handling: Supports up to 50A (TO-264) with copper-alloy leads.
- Reliability: Hermetic sealing in TO-264 variants for harsh environments.
- Space Efficiency: 20% smaller footprint than TO-247 for similar power ratings. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 10.7 × 15.0 mm (TO-264-3), 10.7 × 20.0 mm (TO-264).
- Height: 4.8 mm (TO-264-3), 5.0 mm (TO-264).
- Pin Pitch: 5.45 mm (TO-264-3), variable for TO-264.
- Material: Epoxy resin body with copper leads.
- Temp Range: -55°C to +150°C (junction temperature). -
Q:Where is TO-264-3/TO-264 typically applied?
A:Dominant use cases:
- Power Electronics: Voltage regulators (e.g., LM317 in TO-264), motor drivers.
- Industrial Systems: High-current rectifiers (e.g., STTH diodes in TO-264).
- Automotive: Ignition modules and battery management systems. -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 2 oz copper layers + thermal vias under the tab.
- Mounting: Use thermal grease and M3 screws (torque: 0.5 N·m) for heatsink attachment.
- Reflow Profile: Peak temp ≤ 260°C (SnAgCu solder recommended).
- Inspection: Visual check for lead coplanarity and thermal pad voids (X-ray optional).