TO-263AB

Q:What defines the physical structure of TO-263AB?

A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB attachment.
- Central thermal pad: ~70% substrate coverage for efficient heat dissipation.
- 3 to 7-pin layout: Single-row configuration for simplified routing.
- 2.3 mm profile: Low-height design for space-constrained applications.

Q:Why choose TO-263AB over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller footprint than TO-220.
- Thermal Performance: Direct PCB heat path reduces junction-to-board thermal resistance by 50%.
- Electrical Benefits: Low-inductance (<1 nH) design for high-frequency stability.
- Reliability: Moisture-resistant (MSL3) substrate for harsh environments.

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 10.0 × 9.5 mm
- Height: 2.3 mm
- Pin Pitch: 1.27 mm
- Material: Copper-alloy leads with matte-tin plating.
- Temp Range: -40°C to +150°C (operational).

Q:Where is TO-263AB typically applied?

A:Dominant use cases:
- Power Converters: e.g., Buck/boost regulators (LM2675).
- Motor Drivers: e.g., H-bridge ICs (DRV8873).
- Automotive Systems: e.g., LED drivers (TPS92662).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 4×4 thermal via array under pad (0.3 mm diameter).
- Solder Paste: Type 4 (20–38 μm particle size) for void reduction.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad solder joint validation.