TO-252AB

Q:What defines the physical structure of TO-252AB (DPAK)?

A:Key features include:
- Leadless bottom-mounted pads: For direct PCB soldering.
- Central thermal pad: ~60% coverage of the package base for efficient heat dissipation.
- 3-pin layout: Single-row configuration with standardized pin assignments.
- Low profile: Typical height of 1.7 mm for space-constrained designs.

Q:Why choose TO-252AB over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller footprint than TO-220 for equivalent power handling.
- Thermal Performance: Exposed pad enables direct PCB heat sinking (RθJA as low as 50°C/W).
- Electrical Benefits: Low-inductance leads for high-switching-frequency applications.
- Reliability: Molded epoxy body with moisture resistance (MSL 3 rating).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 6.5 × 6.2 mm (excluding leads).
- Height: 1.7 mm (typical).
- Pin Pitch: 2.3 mm (center-to-center).
- Material: Copper-alloy leads with matte-tin plating.
- Temp Range: -40°C to +150°C (operational).

Q:Where is TO-252AB typically applied?

A:Dominant use cases:
- Power Converters: DC-DC buck/boost ICs (e.g., LM2675).
- Motor Drivers: H-bridge modules (e.g., DRV8873).
- Linear Regulators: High-current LDOs (e.g., LM1084).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Minimum 4×4 thermal vias under the pad (0.3 mm diameter).
- Solder Paste: Type 3 or 4 recommended for pad coverage.
- Reflow Profile: Peak temperature ≤ 250°C (Pb-free process).
- Inspection: AXI (Automated X-ray) to verify voiding <15%.