TO-252AA

Q:What defines the physical structure of TO-252AA (DPAK)?

A:Key features include:
- Leadless bottom-mounted pads for direct PCB soldering.
- Central thermal pad (typically covering 60–70% of the base area) for enhanced heat dissipation.
- 3-pin layout with a single-row arrangement for simplified routing.
- 2.3 mm profile height for low-profile designs.

Q:Why choose TO-252AA over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller footprint than TO-220 for space-constrained applications.
- Thermal Performance: Exposed thermal pad enables direct PCB heat path (RθJA as low as 50°C/W).
- Electrical Benefits: Low-inductance leads (<5 nH) for high-frequency stability.
- Reliability: Moisture-resistant (MSL3-rated) epoxy molding compound.

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 6.5 × 6.2 mm
- Height: 2.3 mm
- Pin Pitch: 2.54 mm
- Material: Copper-alloy leads with matte-tin plating.
- Temp Range: -40°C to +150°C (operational).

Q:Where is TO-252AA typically applied?

A:Dominant use cases:
- Power Converters: DC-DC buck regulators (e.g., LM2675).
- Motor Drivers: H-bridge ICs (e.g., DRV8873).
- Automotive Systems: LED drivers and ECU power modules.

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Minimum 4×4 thermal vias under the pad (0.3 mm diameter).
- Solder Paste: Type 3 or 4 recommended for void control.
- Reflow Profile: Peak temperature ≤ 250°C (Pb-free process).
- Inspection: AXI (Automated X-ray) to verify pad solder joints.