ALL CATEGORIESTO-252-3, DPak
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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Trans MOSFET N-CH 600V 2.4A 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 97
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TRIAC 600V 3A(RMS) 30A 3Pin(2+Tab) MP-3A T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 128
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DPAK N-CH 30V 40A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 562
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DPAK N-CH 700V 8.7A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 472
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Diode: Schottky rectifying; SMD; 650V; 2A; 39.5W; TO252-2
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 607
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DPAK N-CH 30V 50A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 198
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Trans IGBT Chip N-CH 600V 16A 77000mW 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 688
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Thyristor AC Switch Triac 800V 39A 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 394
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Trans IGBT Chip N-CH 600V 30A 240000mW Automotive 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 426
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Trans IGBT Chip N-CH 600V 20A 150000mW Automotive 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 150
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N-Channel MOSFET, 7.3 A, 700 V CoolMOS E6, 3-Pin DPAK Infineon
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 761
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IGBT 600V 30A 250W PG-TO252-3
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 68
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DPAK N-CH 150V 21A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 166
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Diode Schottky 30V 8A 3Pin DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 725
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New P-CH 60V 60A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4000
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Trans IGBT Chip N-CH 600V 20A 3Pin TO-252A T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 894
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Diode Fast Recovery 600V 5A 3Pin TO-252 Embossed T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 985
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Diode Fast Recovery 600V 10A 3Pin TO-252 Embossed T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 466
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Trans IGBT Chip N-CH 600V 10A 3Pin TO-252A T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 969
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TRIAC 600V 5A(RMS) 50A 3Pin(2+Tab) MP-3A T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 643
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Diode Schottky 200V 4A 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 296
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Diode Schottky 100V 3.5A Automotive 3Pin(2+Tab) DPAK Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 396
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TRIAC 700V 5A(RMS) 50A 3Pin(2+Tab) MP-3A T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 941
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TRIAC 600V 3A(RMS) 30A 3Pin(2+Tab) MP-3A T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 652
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Trans IGBT Chip N-CH 600V 8A 75000mW Automotive 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 859
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Trans IGBT Chip N-CH 600V 8A 75000mW Automotive 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 967
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Thyristor TRIAC 700V 80A 3Pin(2+Tab) MP-3A Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 59
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Diode Schottky 40V 7A 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 42
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Diode Schottky 60V 6A 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 805
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Thyristor TRIAC 800V 30A 3Pin(2+Tab) MP-3A Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 714
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Trans IGBT Chip N-CH 600V 11A 58000mW 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 886
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Thyristor SCR 600V 90A 3Pin MP-3A Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 737
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Trans IGBT Chip N-CH 600V 11A 58000mW 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 333
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Trans IGBT Chip N-CH 600V 16A 77000mW 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 414
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VISHAY VS-5EWX06FN-M3 Fast / Ultrafast Power Diode, 600V, 5A, Single, 2.9V, 21ns, 50A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 631
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Diode Switching 1.2kV 4A Automotive 3Pin(2+Tab) TO-252 T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 637
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IGBT Single Transistor, 10 A, 1.5 V, 83 W, 600 V, TO-252, 3 Pins
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 450
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Diode Schottky 30V 12A 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 53
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Trans IGBT Chip N-CH 600V 5A 53600mW Automotive 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 550
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Thyristor SCR 800V 20A 3Pin MP-3A Embossed T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 214
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Igbt 900V 20A 125W C3 To-252
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 825
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700V, 2A, TRIAC, SC-63, MP-3A, 3Pin
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 302
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ON Semi SBR640CTT4G, Dual SMT Schottky Diode, Common Cathode, 40V 6A, 3Pin DPAK
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 426
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Diode: Schottky rectifying; SMD; 650V; 3A; 53W; TO252-2
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 456
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N-Channel MOSFET, 50 A, 30 V OptiMOS 3, 3-Pin DPAK Infineon
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 31
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Thyristor SCR 600V 90A 3Pin(3+Tab) DPAK(L)-(3) Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 506
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Thyristor TRIAC 800V 30A 3Pin(2+Tab) MP-3A T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 562
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800V, 4A, TRIAC, SC-63, MP-3A, 3Pin
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 783
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Thyristor TRIAC 700V 80A 3Pin(2+Tab) MP-3A T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 688
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Trans IGBT Chip N-CH 600V 12A 100000mW Automotive 3Pin(2+Tab) DPAK T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 975
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Q:What defines the physical structure of TO-252-3 (DPak)?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad: Covers ~60% of the base area for efficient heat dissipation.
- 3-pin layout: Single-row configuration with wide pitch for easy routing.
- Low profile: Typical height of 2.3 mm for space-constrained designs. -
Q:Why choose TO-252-3 (DPak) over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than TO-220 for equivalent power handling.
- Thermal Performance: Direct PCB heat path via exposed thermal pad (RθJA as low as 50°C/W).
- Electrical Benefits: Low-inductance leads (<5 nH) for high-frequency stability.
- Reliability: Moisture-resistant (MSL3) epoxy molding compound. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 6.5×6.2 mm (excluding leads).
- Height: 2.3 mm (max).
- Pin Pitch: 2.3 mm (center-to-center).
- Material: Copper-alloy leads with matte-tin plating.
- Temp Range: -55°C to +150°C (operational). -
Q:Where is TO-252-3 (DPak) typically applied?
A:Dominant use cases:
- Power converters: E.g., Buck/boost ICs (e.g., LM2675).
- Motor drivers: E.g., H-bridge modules (e.g., DRV8873).
- Linear regulators: E.g., LDOs (e.g., LM1117). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Minimum 4×4 thermal vias under the pad (0.3 mm diameter).
- Solder Paste: Type 3 or 4 recommended for pad coverage.
- Reflow Profile: Peak temp ≤ 260°C (Pb-free) with 60–90 sec above 217°C.
- Inspection: X-ray (AXI) to verify voiding <25% under thermal pad.