ALL CATEGORIESTO-251(I-PAK)
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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N-channel 100V 7.7A 0.27Ω
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4949
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NPN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4159
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N-channel 600V 4A 4500PCS/...
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1 + 10 + 25 + 50 + >=100 -
1
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15000
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SILICON POWER TRANSISTORS 8 AMPERES 100 VOLTS 20 WATT
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 29688
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MOSFET, Power; N-Ch; VDSS 100V; RDS(ON) 0.185Ohm; ID 10A; I-Pak (TO-251AA); PD 48W
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 451
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Single N-Channel 55 V 45 W 15 nC Hexfet Power Mosfet Through Hole - TO-251AA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100000
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Trans MOSFET P-CH 100V 6.6A 3-Pin(3+Tab) IPAK Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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MOSFET, Power; P-Ch; VDSS -100V; RDS(ON) 0.205Ω; ID -13A; I-Pak (TO-251AA); PD 66W
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4125
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Pwr MOSFET, 500V Single N-Ch. HEXFET; I-PAK
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12750
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Trans MOSFET N-CH 500V 3.3A 3-Pin(3+Tab) IPAK
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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N-Channel MOSFET, 16 A, 100 V HEXFET, 3-Pin IPAK Infineon
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15094
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HEXFET Power MOSFET
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 58000
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Trans MOSFET N-CH 55V 71A 3-Pin(3+Tab) IPAK
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4030
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Trans MOSFET N-CH 400V 3.1A 3-Pin(3+Tab) IPAK
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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MOSFET, Power; N-Ch; VDSS 200V; RDS(ON) 600 Milliohms; ID 5A; I-Pak (TO-251AA); PD 43W
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1044
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MOSFET, Power; N-Ch; VDSS 55V; RDS(ON) 0.075Ω; ID 17A; I-Pak (TO-251AA); PD 45W
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4539
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Q:What defines the physical structure of TO-251 (I-PAK)?
A:Key features include:
- Leaded design: Three external pins for easy PCB mounting.
- Central thermal pad: Exposed pad (typically ~60% coverage) for enhanced heat dissipation.
- 3-pin layout: Pins arranged in a single row with standardized spacing.
- Compact profile: Body thickness of ~2.3 mm for space-constrained applications. -
Q:Why choose TO-251 (I-PAK) over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than TO-252 (DPAK) for high-density designs.
- Thermal Performance: Direct PCB heat sinking via the central pad, reducing junction temperature by ~15%.
- Electrical Benefits: Low-inductance leads for stable power delivery in switching circuits.
- Reliability: Molded epoxy body with moisture resistance (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 6.5 × 6.1 mm
- Height: 2.3 mm
- Pin Pitch: 2.54 mm
- Material: Copper-alloy leads with matte tin plating.
- Temp Range: -40°C to +150°C (operational). -
Q:Where is TO-251 (I-PAK) typically applied?
A:Dominant use cases:
- Power Management: DC-DC converters (e.g., LM2596 modules).
- Motor Drivers: H-bridge circuits (e.g., DRV8871).
- LED Lighting: High-current drivers (e.g., PT4115). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use 4+ thermal vias under the central pad for optimal heat transfer.
- Solder Paste: Type 3 or 4 solder paste (0.1–0.15 mm stencil thickness).
- Reflow Profile: Peak temperature ≤ 250°C (Pb-free process).
- Inspection: Visual inspection for pin alignment; AXI recommended for void detection.