TO-220FPAB

Q:What defines the physical structure of TO-220FPAB?

A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad: (~80% coverage) for efficient heat dissipation.
- 3-pin layout with linear arrangement: Simplified wiring and space optimization.
- 2.3 mm ultra-thin profile: Reduces vertical space occupancy.

Q:Why choose TO-220FPAB over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller footprint than TO-220F.
- Thermal Performance: Direct PCB heat path via central pad (RθJA ≤ 50°C/W).
- Electrical Benefits: Low-inductance design (<5 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL 2A certified).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 10.0 × 4.5 mm
- Height: 2.3 mm
- Pin Pitch: 2.54 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +150°C.

Q:Where is TO-220FPAB typically applied?

A:Dominant use cases:
- Power Converters: Buck/boost regulators (e.g., LM2675).
- Motor Drivers: H-bridge modules (e.g., DRV8873).
- Industrial Controls: PLC I/O interfaces (e.g., ISO7740).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 4×4 thermal vias array under pad (0.3 mm diameter).
- Solder Paste: Type 4 (Sn96.5/Ag3.0/Cu0.5) recommended.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).