TO247

Q:What defines the physical structure of TO247?

A:Key features include:
- Leaded design: Robust through-hole or surface-mountable leads for high-current applications.
- Central thermal pad: Large exposed metal tab (typically ~15×20 mm coverage) for efficient heat dissipation.
- 3-pin layout: Standard configuration with linear lead arrangement for easy PCB routing.
- Durable housing: Molded epoxy body with ~10–15 mm height for mechanical stability.

Q:Why choose TO247 over alternatives?

A:Critical advantages:
- High power handling: Supports currents up to 75A and voltages exceeding 1000V (e.g., vs. TO220).
- Thermal Performance: Direct-attach thermal pad reduces junction-to-case resistance (<1.5°C/W).
- Electrical Benefits: Low-inductance leads minimize switching losses in power devices.
- Reliability: Industrial-grade materials withstand harsh environments (e.g., -55°C to +175°C).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 16×21 mm (varies by variant).
- Height: 10–15 mm (including leads).
- Pin Pitch: 5.45 mm (standard spacing).
- Material: Copper-alloy leads with epoxy encapsulation.
- Temp Range: -55°C to +175°C (operational).

Q:Where is TO247 typically applied?

A:Dominant use cases:
- Power electronics: High-voltage MOSFETs/IGBTs (e.g., Infineon IKW75N65EH5).
- Motor drives: Inverters for industrial/EV systems (e.g., STMicroelectronics STGW40H65DFB).
- Renewable energy: Solar inverters and wind turbine converters.

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Use 2 oz copper layers and thermal vias under the pad.
- Solder Paste: Lead-free (SAC305) or high-temperature alloys for wave soldering.
- Mounting: Secure with M3 screws (torque: 0.5–0.6 Nm) for thermal interface.
- Inspection: Visual check for lead coplanarity and thermal pad voids (X-ray recommended).