TO220F
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- Description
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- Quantity
- Operation
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Q:What defines the physical structure of TO220F?
A:Key features include:
- Molded epoxy body: Robust insulation and mechanical protection.
- Three-terminal design: Standard pin layout (Gate/Drain/Source for MOSFETs).
- Integrated metal tab: Exposed thermal pad for heatsink mounting (typically 10.4×15.6 mm coverage).
- Through-hole mounting: Bent leads for PCB insertion (lead pitch: 2.54 mm). -
Q:Why choose TO220F over alternatives?
A:Critical advantages:
- Thermal Performance: Direct heatsink attachment (RθJA as low as 62°C/W with heatsink).
- High Current Handling: Supports up to 75A (e.g., power MOSFETs like IRF540N).
- Cost-Effective: Widely standardized for mass production.
- Reliability: UL94 V-0 flame-resistant epoxy material. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 10.4 × 15.6 mm (excluding leads).
- Height: 4.8 mm (tab to top).
- Lead Pitch: 2.54 mm.
- Material: Copper-alloy leads, epoxy body.
- Temp Range: -55°C to +150°C (operational). -
Q:Where is TO220F typically applied?
A:Dominant use cases:
- Power Electronics: Voltage regulators (e.g., LM317), motor drivers.
- Switching Circuits: DC-DC converters (e.g., buck/boost modules).
- Amplifiers: Audio/RF power stages (e.g., TDA2030). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Ensure adequate trace width for high-current paths (≥2 oz copper).
- Heatsink Mounting: Use thermal grease (e.g., Arctic MX-4) and secure with M3 screws.
- Soldering: Wave soldering (260°C max) or hand soldering (350°C max, 3 sec/lead).
- Inspection: Visual check for lead straightness and tab alignment.



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