SSOP-28
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- Description
- Unite Price
- Quantity
- Operation
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4KB 64KB 2.5V~5.5V CM0 48MHz 32 SSOP-28 Microcontroller Units (MCUs/MPUs/SOCs) ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2173
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8Bit SSOP-28 Analog To Digital Converters (ADCs) ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4587
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PB-FREE DUAL SWITCHER W/DRR OPTION, 30V HT SUSA CODE:8542390000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1067
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Specialized Interface, UART, AS - I Networks, 16 V, 33.1 V, SSOP, 28 Pins
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1381
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AS-Interface Spec. V3.0 Compliant Universal AS-i IC
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2163
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MCU 32-bit ARM Cortex M0 RISC 32KB Flash 3V/5V 28-Pin SSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4000
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32bit ARM Cortex M0 Microcontroller, 24MHz, 16 kB Flash, 28-Pin SSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
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MCU 32-bit ARM Cortex M0 RISC 16KB Flash 3V/5V 28-Pin SSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 120
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Full Speed Programmable USB Controller USB 2.0 3.3V/5V Tube 28-Pin SSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 308
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Microcontroller; SRAM:8KB; Flash:16KB; 48MHz; SSOP28; PWM:8
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 756
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Audio Control, Audio Processor, 7V to 9.5V, I2C, SSOP, 28 Pins, -40 °C
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 239
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Interface Bridges, USB to UART, 1.71 V, 5.5 V, SSOP, 28 Pins, -40 °C
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 837
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CY7C65213 Series 1.71 - 5.5 V USB 2.0 20 mA 12 Mbps Bridge Controller - QFN-32
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15
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28-Pin Flash Microcontrollers with nanoWatt XLP Technology
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4401
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8-bit Microcontrollers - MCU 8-Bit MCU 56KB Flash 4KB RAM 256B EE CIP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5076
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8-bit Microcontrollers - MCU 8-Bit MCU 28KB Flash 2KB RAM 256B EE CIP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6271
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8 Bit MCU, PIC16 Family PIC16F18xx Series Microcontrollers, 32 MHz, 28 KB, 2 KB, 28 Pins, SSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15
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8-bit Microcontrollers - MCU 8-Bit MCU 28KB Flash 2KB RAM 256B EE CIP
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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8 Bit MCU, Extreme Low Power(XLP), PIC16 Family PIC16F18XX Series Microcontrollers, 32 MHz, 14 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4660
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MCU 8-bit PIC RISC 14KB Flash 2.5V/3.3V/5V 28-Pin SSOP Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3806
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MCU 16-bit PIC RISC 7KB Flash 3.3V 28-Pin SSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3852
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8 Bit MCU, PIC16 Family PIC16F188xx Series Microcontrollers, 32 MHz, 7 KB, 512 Byte, 28 Pins, SSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6993
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MCU 16-bit PIC RISC 7KB Flash 3.3V 28-Pin SSOP Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 718
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Q:What defines the physical structure of SSOP-28?
A:Key features include:
- Gull-wing leads: 28-pin configuration with dual-side outward bending.
- Compact footprint: 7.8×5.6 mm body size for space-constrained designs.
- Thin profile: 1.75 mm maximum height for low-profile applications.
- Standardized pin pitch: 0.65 mm spacing for compatibility with automated assembly. -
Q:Why choose SSOP-28 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOIC-28 while maintaining similar I/O capacity.
- Thermal Performance: Exposed die pad (3.2×4.0 mm coverage) for enhanced PCB heat dissipation.
- Electrical Benefits: Low-inductance lead frame design for high-frequency signal integrity.
- Reliability: Moisture-resistant (MSL3) mold compound for harsh environments. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 7.8 × 5.6 mm
- Height: 1.75 mm (max)
- Pin Pitch: 0.65 mm
- Material: Copper-alloy leads with Sn/Pb or lead-free plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is SSOP-28 typically applied?
A:Dominant use cases:
- Power Management: DC-DC converters (e.g., TI TPS5430).
- Communication ICs: RS-485 transceivers (e.g., MAX485).
- Embedded Systems: Microcontroller interfaces (e.g., STM32 series). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias under exposed pad (≥4 vias recommended).
- Solder Paste: Type 3 or 4 for precise deposition on 0.65 mm pitch.
- Reflow Profile: Peak temperature ≤ 250°C (lead-free) with 60–90 sec above 217°C.
- Inspection: Optical/AXI required for lead coplanarity and solder joint voids.



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