SSOP
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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Module DC-DC 24VIN 1-OUT 18V to 25V 0.1A 1.5W Automotive 36-Pin SSOP Tube
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1 + 10 + 25 + 50 + >=100 -
1
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I2S 2.7V~5.5V 24Bit MSOP-10 Digital To Analog Converters (DACs) ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1452
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Dual-Output Power Supply Controller for Notebook Computers
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 240
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5V to 3.3V Output, Synchronous, Step-Down Power Supply Controller
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 416
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LTC1380 - Single-Ended 8Channel/ Differential 4Channel Analog Multiplexer with SMBus Interface
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2
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MCU 8Bit 78K0S/Kx1+ 78K0S CISC 4KB Flash 3.3V/5V 16Pin SSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 689
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LTC1380 - Single-Ended 8Channel/ Differential 4Channel Analog Multiplexer with SMBus Interface
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1 + 10 + 25 + 50 + >=100 -
1
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Battery Management ; Multicell Battery Stack Monitor
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4662
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Q:What defines the physical structure of SSOP?
A:Key features include:
- Gull-wing leads: Bent outward for surface-mounting.
- Compact footprint: Up to 30% smaller than standard SOP.
- Pin layout: Typically 8 to 64 pins with dual-row alignment.
- Low profile: Height ranges from 1.0 mm to 2.0 mm. -
Q:Why choose SSOP over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOP packages.
- Thermal Performance: Efficient heat dissipation via exposed pads (optional).
- Electrical Benefits: Low-inductance leads for high-frequency applications.
- Reliability: JEDEC-compliant moisture resistance (MSL 3). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 3.0×4.0 mm to 10.0×10.0 mm.
- Height: 1.0–2.0 mm.
- Pin Pitch: 0.5 mm or 0.65 mm.
- Material: Copper-alloy leads with mold compound body.
- Temp Range: -40°C to +125°C. -
Q:Where is SSOP typically applied?
A:Dominant use cases:
- Consumer Electronics: USB controllers (e.g., FTDI FT232).
- Industrial Systems: Motor drivers (e.g., DRV8825).
- Telecom: RF transceivers (e.g., nRF24L01+). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use 0.1 mm solder mask dams between pins.
- Solder Paste: Type 3 or 4 for fine-pitch (0.5 mm).
- Reflow Profile: Peak temp ≤ 250°C (Pb-free).
- Inspection: AOI (Automated Optical Inspection) for lead coplanarity.



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