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SOT-669

The SOT-669 is a surface-mount package designed for high-density circuits. Featuring leadless design, exposed thermal pad, and ultra-thin profile, it delivers superior heat dissipation, reduced signal interference, and compact form factor. Typical dimensions are 4.0 mm × 4.0 mm × 1.0 mm with a 0.65 mm pin pitch, making it ideal for power management ICs in portable devices. Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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  • PSMN0R9-25YLD
  • PSMN0R9-25YLD Hot Sale

    Manufacturer: NEXPERIA

    Package/Case: SOT-669

  • NXP PSMN0R9-25YLD MOSFET Transistor, NextPowerS3, N Channel, 300A, 25V, 0.00072Ω, 10V, 1.73V
  • 1 +
    10 +
    25 +
    50 +
    >=100
  • Minimum : 1 In-stock : 1367
  • PSMN7R0-30YLC
  • PSMN7R0-30YLC Hot Sale

    Manufacturer: NXP

    Package/Case: SOT-669

  • N-channel 30 V 7.1 mΩ logic level MOSFET in LFPAK using NextPower technology
  • 1 +
    10 +
    25 +
    50 +
    >=100
  • Minimum : 1 In-stock : 500
  • PSMN1R8-40YLC
  • PSMN1R8-40YLC Hot Sale

    Manufacturer: NXP

    Package/Case: SOT-669

  • N-channel 40 V 1.8 mΩ logic level MOSFET in LFPAK using NextPower technology
  • 1 +
    10 +
    25 +
    50 +
    >=100
  • Minimum : 1 In-stock : 9999
  • PSMN102-200Y
  • PSMN102-200Y Hot Sale

    Manufacturer: NXP

    Package/Case: SOT-669

  • N-channel TrenchMOS standard level FET - Configuration: Single N-channel ; ID DC: 21.5 A; Qgd (typ): 10.1 nC; RDS(on): 102@10V mOhm; VDSmax: 200 V
  • 1 +
    10 +
    25 +
    50 +
    >=100
  • Minimum : 1 In-stock : 3000