SOT96
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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TJA1051T Series 4.5 -5.5 V SMT High-Speed CAN Transceiver - SOIC-8
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2677
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Calendar, Clock IC, Format (YYYY:MM:WK:DD:hh:mm:ss/Binary), I2C, 900 mV to 5.5 V supply, SOIC-8
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3173
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NTAG I C < > 2K, NFC F T 2 T I C - NFC 11AC3615 New
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1160
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TRANSCEIVER, PHYSICAL LAYER, LIN 2.1 / SAEJ2602-2, 20KBPS,TX/RX SYMMETRY, SOIC 8 TR 11AC3455 New
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3353
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Calendar, Clock IC, Format (YYYY:MM:WK:DD:hh:mm:ss/Binary), I2C, 900 mV to 5.5 V supply, SOIC-8
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5200
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DC/DC Switching Controllers GREENCHIP SMPS CONTROL IC
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 520000
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Switching Converters, Regulators & Controllers TEA1656T/SO8/REEL13/
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2500
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Switching Converters, Regulators & Controllers TEA1532BT / SO8 / REEL13N1
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 65200
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Low Dropout (LDO) Regulators TDA3663AT / SO8 / REEL13N1
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6800
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P-channel TrenchMOS extremely low level FET - Configuration: Single P-channel ; ID DC: -14.9 A; RDS(on): 19@-10V mOhm; VDSmax: -30 V; Package: SOT96-1 (SO8); Container: Reel Dry Pack, SMD, 13"
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 132500
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Q:What defines the physical structure of SOT96?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Optimizes heat dissipation.
- 6-pin layout with dual-row arrangement: Space-efficient design.
- 0.8 mm ultra-thin profile: Ideal for low-height applications. -
Q:Why choose SOT96 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOP-8 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.0 × 1.6 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is SOT96 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62130).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., CC2541).
- Sensor Interfaces: MEMS sensors (e.g., BME280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use 4×4 thermal vias under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 μm).
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.



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